Imaging device and electronic device

ABSTRACT

An imaging device having a three-dimensional integration structure is provided. A first structure including a transistor including silicon in an active layer or an active region and a second structure including an oxide semiconductor in an active layer are fabricated. After that, the first and second structures are bonded to each other so that metal layers included in the first and second structures are bonded to each other; thus, an imaging device having a three-dimensional integration structure is formed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.15/383,327, filed Dec. 19, 2016, now allowed, which claims the benefitof foreign priority applications filed in Japan as Serial No.2015-256138 on Dec. 28, 2015, and Serial No. 2016-171454 on Sep. 2, 2016all of which are incorporated by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

One embodiment of the present invention relates to an imaging device.

Note that one embodiment of the present invention is not limited to theabove technical field. The technical field of one embodiment of theinvention disclosed in this specification and the like relates to anobject, a method, or a manufacturing method. One embodiment of thepresent invention relates to a process, a machine, manufacture, or acomposition of matter. Specifically, examples of the technical field ofone embodiment of the present invention disclosed in this specificationinclude a semiconductor device, a display device, a liquid crystaldisplay device, a light-emitting device, a lighting device, a powerstorage device, a storage device, an imaging device, a method foroperating any of them, and a method for manufacturing any of them.

In this specification and the like, a semiconductor device generallymeans a device that can function by utilizing semiconductorcharacteristics. A transistor and a semiconductor circuit areembodiments of semiconductor devices. In some cases, a storage device, adisplay device, an imaging device, or an electronic device includes asemiconductor device.

2. Description of the Related Art

An oxide semiconductor has attracted attention as a semiconductormaterial applicable to the transistor. For example, a technique forforming a transistor using zinc oxide or an In—Ga—Zn-based oxidesemiconductor as an oxide semiconductor is disclosed (see PatentDocuments 1 and 2).

Patent Document 3 discloses an imaging device in which a transistorincluding an oxide semiconductor is used in part of a pixel circuit.

Patent Document 4 discloses an imaging device in which a transistorincluding silicon, a transistor including an oxide semiconductor, and aphotodiode including a crystalline silicon layer are stacked.

REFERENCE

-   Patent Document 1: Japanese Published Patent Application No.    2007-123861-   Patent Document 2: Japanese Published Patent Application No.    2007-096055-   Patent Document 3: Japanese Published Patent Application No.    2011-119711-   Patent Document 4: Japanese Published Patent Application No.    2013-243355

SUMMARY OF THE INVENTION

A semiconductor integrated circuit with high density and large capacityhas been developed; meanwhile, miniaturization of the semiconductorintegrated circuit is required. Thus, two-dimensional integration hasbeen shifted actively to three-dimensional integration.

Although a manufacturing process of three-dimensional integrationstructure may be complicated, the degree of freedom of the materials andthe design rule of layers can be increased. Therefore, a high-functionalsemiconductor integrated circuit which is difficult to be manufacturedby two-dimensional integration can be manufactured.

In view of the above, an object of one embodiment of the presentinvention is to provide an imaging device having a three-dimensionalintegration structure. Another object is to provide an imaging devicecapable of division driving. Another object is to provide an imagingdevice that can be downsized. Another object is to provide an imagingdevice capable of taking an image with little noise. Another object isto provide an imaging device suitable for high-speed operation. Anotherobject is to provide an imaging device with high resolution. Anotherobject is to provide an imaging device capable of taking an image undera low illuminance condition. Another object is to provide an imagingdevice which can be used in a wide temperature range. Another object isto provide an imaging device with a high aperture ratio. Another objectis to provide an imaging device with high reliability. Another object isto provide a novel imaging device or the like.

Note that the descriptions of these objects do not disturb the existenceof other objects. In one embodiment of the present invention, there isno need to achieve all the objects. Other objects will be apparent fromand can be derived from the description of the specification, thedrawings, the claims, and the like.

One embodiment of the present invention is related to an imaging devicewith a stacked structure.

One embodiment of the present invention is an imaging device including afirst layer, a second layer, and a third layer. The first layer includesa photoelectric conversion element. The second layer includes a firsttransistor including an oxide semiconductor in an active layer, a firstinsulating layer, and a first metal layer. The third layer including asecond transistor includes silicon in an active layer or an activeregion, a second insulating layer, and a second metal layer. The secondlayer is provided between the first layer and the third layer. The firstmetal layer and the second metal layer are formed using metal elementsusing the same main component. The first metal layer has a regionembedded in the first insulating layer and a region bonded to the secondmetal layer. The second metal layer has a region embedded in the secondinsulating layer. The first insulating layer has a region bonded to thesecond insulating layer. The first transistor and the second transistorare arranged so that top surfaces of gate electrodes thereof face eachother. The photoelectric conversion element is electrically connected tothe first transistor. The first transistor and the second transistor areelectrically connected to the first metal layer and the second metallayer, respectively.

The second layer can include an n-channel third transistor including anoxide semiconductor in an active layer and include a third metal layer.The third layer can include a p-channel fourth transistor includingsilicon in an active layer or an active region and include a fourthmetal layer. The third metal layer and the fourth metal layer can beformed using metal elements using the same main component. The thirdmetal layer can have a region embedded in the first insulating layer anda region bonded to the fourth metal layer. The fourth metal layer canhave a region embedded in the second insulating layer. The thirdtransistor and the fourth transistor can be arranged so that topsurfaces of gate electrodes thereof face each other. The thirdtransistor and the fourth transistor can be electrically connected tothe third metal layer and the fourth metal layer, respectively.

Another embodiment of the present invention is an imaging deviceincluding a first layer, a second layer, and a third layer. The firstlayer includes a photoelectric conversion element, a third insulatinglayer, and a fifth metal layer. The second layer includes a firsttransistor including an oxide semiconductor in an active layer, a fourthinsulating layer, and a sixth metal layer. The third layer includes asecond transistor including silicon in an active layer or an activeregion. The second layer is provided between the first layer and thethird layer. The fifth metal layer and the sixth metal layer are formedusing metal elements using the same main component. The fifth metallayer has a region embedded in the third insulating layer and a regionbonded to the sixth metal layer. The sixth metal layer has a regionembedded in the fourth insulating layer. The third insulating layer hasa region bonded to the fourth insulating layer. The photoelectricconversion element is electrically connected to the fifth metal layer.The first transistor and the second transistor are electricallyconnected to the fifth metal layer and the first transistor,respectively.

The metal element is preferably Cu, Al, W, or Au.

The oxide semiconductor preferably contains In, Zn, and M (M is Al, Ga,Y, or Sn).

One embodiment of the present invention can provide an imaging devicehaving a three-dimensional integration structure. An imaging devicecapable of division driving can be provided. An imaging device that canbe downsized can be provided. An imaging device capable of taking animage with little noise can be provided. An imaging device suitable forhigh-speed operation can be provided. An imaging device with highresolution can be provided. An imaging device capable of taking an imageunder a low illuminance condition can be provided. An imaging devicewhich can be used in a wide temperature range can be provided. Animaging device with a high aperture ratio can be provided. An imagingdevice with high reliability can be provided. A novel imaging device orthe like can be provided.

Note that one embodiment of the present invention is not limited tothese effects. For example, depending on circumstances or conditions,one embodiment of the present invention might produce another effect.Furthermore, depending on circumstances or conditions, one embodiment ofthe present invention might not produce any of the above effects.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIG. 1A illustrates a pixel of an imaging device, and FIG. 1B is acircuit diagram thereof;

FIGS. 2A and 2B each illustrate a pixel of an imaging device;

FIGS. 3A to 3C are cross-sectional views illustrating a structure of animaging device;

FIGS. 4A and 4B are cross-sectional views each illustrating a structureof an imaging device;

FIG. 5 is a cross-sectional view illustrating a structure of an imagingdevice;

FIGS. 6A to 6E are cross-sectional views each illustrating a connectionconfiguration of a photoelectric conversion element;

FIGS. 7A to 7D are cross-sectional views each illustrating a connectionconfiguration of a photoelectric conversion element;

FIGS. 8A to 8D are a cross-sectional view illustrating a structure of animaging device and cross-sectional views each illustrating a connectionconfiguration of a photoelectric conversion element;

FIG. 9 is a cross-sectional view illustrating a structure of an imagingdevice;

FIG. 10 is a cross-sectional view illustrating a structure of an imagingdevice;

FIGS. 11A1, 11A2, 11A3, 11B1, 11B2, 11B3, and 11B4 illustrate amanufacturing process of an imaging device;

FIGS. 12A1, 12A2, 12A3, 12A4, 12B1, 12B2, 12B3, 12B4, and 12B5illustrate a manufacturing process of an imaging device;

FIG. 13 is a cross-sectional view illustrating a structure of an imagingdevice;

FIG. 14 is a cross-sectional view illustrating a structure of an imagingdevice;

FIGS. 15A and 15B are a block diagram illustrating an imaging device, acircuit diagram of a CDS circuit, and a block diagram of an A/Dconverter circuit;

FIGS. 16A, 16B1, 16B2, and 16C are top views and a perspective viewillustrating a structure of an imaging device;

FIGS. 17A to 17D are cross-sectional views each illustrating a structureof an imaging device;

FIG. 18 is a cross-sectional view illustrating a structure of an imagingdevice;

FIG. 19 is a cross-sectional view illustrating a structure of an imagingdevice;

FIGS. 20A and 20B are circuit diagrams each illustrating a pixel;

FIGS. 21A to 21C are circuit diagrams each illustrating a pixel;

FIG. 22 is a timing chart illustrating operation of an imaging device;

FIGS. 23A and 23B are circuit diagrams each illustrating a pixel;

FIGS. 24A1, 24A2, 24A3, 24B1, 24B2, and 24B3 illustrate bent imagingdevices;

FIGS. 25A to 25F are top views and cross-sectional views illustratingtransistors;

FIGS. 26A to 26F are top views and cross-sectional views illustratingtransistors;

FIGS. 27A to 27D are cross-sectional views of transistors in the channelwidth direction;

FIGS. 28A to 28F are cross-sectional views of transistors in the channellength direction;

FIGS. 29A to 29E are a top view and cross-sectional views illustrating asemiconductor layer;

FIGS. 30A to 30F are top views and cross-sectional views illustratingtransistors;

FIGS. 31A to 31F are top views and cross-sectional views illustratingtransistors;

FIGS. 32A to 32D are cross-sectional views of transistors in the channelwidth direction;

FIGS. 33A to 33F are cross-sectional views of transistors in the channellength direction;

FIGS. 34A and 34B are a top view and a cross-sectional view illustratinga transistor;

FIGS. 35A to 35C are top views each illustrating a transistor;

FIGS. 36A to 36C each illustrate the range of the atomic ratio of anoxide semiconductor;

FIG. 37 illustrates a crystal structure of InMZnO₄;

FIGS. 38A and 38B are each a band diagram of a stacked structure of anoxide semiconductor;

FIGS. 39A to 39E show structural analysis of a CAAC-OS and a singlecrystal oxide semiconductor by XRD and selected-area electrondiffraction patterns of a CAAC-OS;

FIGS. 40A to 40E show a cross-sectional TEM image and plan-view TEMimages of a CAAC-OS and images obtained through analysis thereof;

FIGS. 41A to 41D show electron diffraction patterns and across-sectional TEM image of an nc-OS;

FIGS. 42A and 42B show cross-sectional TEM images of an a-like OS;

FIG. 43 shows changes in crystal parts of In—Ga—Zn oxides induced byelectron irradiation;

FIGS. 44A to 44D are perspective views and a cross-sectional viewillustrating a package including an imaging device;

FIGS. 45A to 45D are perspective views and a cross-sectional viewillustrating a package including an imaging device;

FIGS. 46A to 46F illustrate electronic devices; and

FIGS. 47A and 47B are a photograph showing the appearance of an X-rayimaging panel and a photograph obtained by X-ray imaging.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments will be described in detail with reference to the drawings.Note that the present invention is not limited to the followingdescription. Note that the present invention is not limited to thefollowing description and it will be readily appreciated by thoseskilled in the art that modes and details can be modified in variousways without departing from the spirit and the scope of the presentinvention. Therefore, the present invention should not be interpreted asbeing limited to the description of embodiments below. Note that instructures of the present invention described below, the same portionsor portions having similar functions are denoted by the same referencenumerals in different drawings, and description thereof is not repeatedin some cases. It is also to be noted that the same components aredenoted by different hatching patterns in different drawings, or thehatching patterns are omitted in some cases.

Note that the ordinal numbers such as “first” and “second” in thisspecification are used for convenience and do not denote the order ofsteps or the stacking order of layers. Therefore, for example, the term“first” can be replaced with the term “second”, “third”, or the like asappropriate. In addition, the ordinal numbers in this specification andthe like do not correspond to the ordinal numbers which specify oneembodiment of the present invention in some cases.

For example, in this specification and the like, an explicit description“X and Y are connected” means that X and Y are electrically connected, Xand Y are functionally connected, and X and Y are directly connected.Accordingly, without being limited to a predetermined connectionrelationship, for example, a connection relationship shown in drawingsor texts, another connection relationship is included in the drawings orthe texts.

Here, X and Y each denote an object (e.g., a device, an element, acircuit, a wiring, an electrode, a terminal, a conductive film, or alayer).

Examples of the case where X and Y are directly connected include thecase where an element that allows an electrical connection between X andY (e.g., a switch, a transistor, a capacitor, an inductor, a resistor, adiode, a display element, a light-emitting element, or a load) is notconnected between X and Y, and the case where X and Y are connectedwithout the element that allows the electrical connection between X andY provided therebetween.

Examples of the case where X and Y are electrically connected includethe case where one or more elements that allow an electrical connectionbetween X and Y (e.g., a switch, a transistor, a capacitor, an inductor,a resistor, a diode, a display element, a light-emitting element, or aload) can be connected between X and Y. Note that the switch iscontrolled to be turned on or off. That is, the switch is conducting ornot conducting (is turned on or off) to determine whether current flowstherethrough or not. Alternatively, the switch has a function ofselecting and changing a current path. Note that the case where X and Yare electrically connected includes the case where X and Y are directlyconnected.

Examples of the case where X and Y are functionally connected includethe case where one or more circuits that allow functional connectionbetween X and Y (e.g., a logic circuit such as an inverter, a NANDcircuit, or a NOR circuit; a signal converter circuit such as a D/Aconverter circuit, an A/D converter circuit, or a gamma correctioncircuit; a potential level converter circuit such as a power supplycircuit (e.g., a step-up converter, or a step-down converter) or a levelshifter circuit for changing the potential level of a signal; a voltagesource; a current source; a switching circuit; an amplifier circuit suchas a circuit that can increase signal amplitude, the amount of current,or the like, an operational amplifier, a differential amplifier circuit,a source follower circuit, or a buffer circuit; a signal generationcircuit; a memory circuit; and/or a control circuit) can be connectedbetween X and Y. For example, even when another circuit is interposedbetween X and Y, X and Y are functionally connected if a signal outputfrom X is transmitted to Y. Note that the case where X and Y arefunctionally connected includes the case where X and Y are directlyconnected and the case where X and Y are electrically connected.

Note that an explicit description “X and Y are electrically connected”means that X and Y are electrically connected (i.e., the case where Xand Y are connected with another element or another circuit providedtherebetween), X and Y are functionally connected (i.e., the case whereX and Y are functionally connected with another circuit providedtherebetween), and X and Y are directly connected (i.e., the case whereX and Y are connected without another element or another circuitprovided therebetween). That is, in this specification and the like, theexplicit description “X and Y are electrically connected” is the same asthe description “X and Y are connected”.

For example, any of the following expressions can be used for the casewhere a source (or a first terminal or the like) of a transistor iselectrically connected to X through (or not through) Z1 and a drain (ora second terminal or the like) of the transistor is electricallyconnected to Y through (or not through) Z2, or the case where a source(or a first terminal or the like) of a transistor is directly connectedto one part of Z1 and another part of Z1 is directly connected to Xwhile a drain (or a second terminal or the like) of the transistor isdirectly connected to one part of Z2 and another part of Z2 is directlyconnected to Y.

Examples of the expressions include, “X, Y, a source (or a firstterminal or the like) of a transistor, and a drain (or a second terminalor the like) of the transistor are electrically connected to each other,and X, the source (or the first terminal or the like) of the transistor,the drain (or the second terminal or the like) of the transistor, and Yare electrically connected to each other in this order”, “a source (or afirst terminal or the like) of a transistor is electrically connected toX, a drain (or a second terminal or the like) of the transistor iselectrically connected to Y, and X, the source (or the first terminal orthe like) of the transistor, the drain (or the second terminal or thelike) of the transistor, and Y are electrically connected to each otherin this order”, and “X is electrically connected to Y through a source(or a first terminal or the like) and a drain (or a second terminal orthe like) of a transistor, and X, the source (or the first terminal orthe like) of the transistor, the drain (or the second terminal or thelike) of the transistor, and Y are provided to be connected in thisorder”. When the connection order in a circuit configuration is definedby an expression similar to the above examples, a source (or a firstterminal or the like) and a drain (or a second terminal or the like) ofa transistor can be distinguished from each other to specify thetechnical scope.

Other examples of the expression include “a source (or a first terminalor the like) of a transistor is electrically connected to X through atleast a first connection path, the first connection path does notinclude a second connection path, the second connection path is a pathbetween the source (or the first terminal or the like) of the transistorand a drain (or a second terminal or the like) of the transistor, Z1 ison the first connection path, the drain (or the second terminal or thelike) of the transistor is electrically connected to Y through at leasta third connection path, the third connection path does not include thesecond connection path, and Z2 is on the third connection path” and “asource (or a first terminal or the like) of a transistor is electricallyconnected to X through at least a first connection path on which Z1 isprovided, the first connection path does not include a second connectionpath, the second connection path includes a connection path on which thetransistor is provided, a drain (or a second terminal or the like) ofthe transistor is electrically connected to Y through at least a thirdconnection path on which Z2 is provided, and the third connection pathdoes not include the second connection path”. Another examples of theexpression include “a source (or a first terminal or the like) of atransistor is electrically connected to X through at least a firstconnection path on which Z1 is provided, the first connection path doesnot include a second connection path, the second connection path is apath between the source (or the first terminal or the like) and a drain(or a second terminal or the like) of the transistor, the drain (or thesecond terminal or the like) of the transistor is electrically connectedto Y through at least a third connection path on which Z2 is provided,the third connection path does not include a fourth connection path, andthe fourth connection path is a path between the drain (or a secondterminal or the like) and the source (or the first terminal or the like)of the transistor. When the connection order in a circuit configurationis defined by an expression similar to the above examples, a source (ora first terminal or the like) and a drain (or a second terminal or thelike) of a transistor can be distinguished from each other to specifythe technical scope.

Note that these expressions are examples and there is no limitation onthe expressions. Here, X, Y, Z1, and Z2 each denote an object (e.g., adevice, an element, a circuit, a wiring, an electrode, a terminal, aconductive film, or a layer).

Even when independent components are electrically connected to eachother in a circuit diagram, one component has functions of a pluralityof components in some cases. For example, when part of a wiring alsofunctions as an electrode, one conductive film functions as the wiringand the electrode. Thus, “electrical connection” in this specificationincludes in its category such a case where one conductive film hasfunctions of a plurality of components.

Note that the terms “film” and “layer” can be interchanged with eachother depending on the case or circumstances. For example, the term“conductive layer” can be changed into the term “conductive film” insome cases. Also, the term “insulating film” can be changed into theterm “insulating layer” in some cases.

Note that in general, a potential (a voltage) is relative and isdetermined depending on the amount relative to a reference potential.Therefore, even when the expression “ground”, “GND”, or the like isused, the potential is not necessarily 0 V. For example, the “groundpotential” or “GND” may be defined using the lowest potential in acircuit as a reference. Alternatively, the “ground potential” or “GND”may be defined using an intermediate potential in a circuit as areference. In those cases, a positive potential and a negative potentialare set using the potential as a reference.

Embodiment 1

In this embodiment, an imaging device that is one embodiment of thepresent invention will be described with reference to drawings.

Embodiments of the present invention are the structure and themanufacturing method of an imaging device having a three-dimensionalintegration structure formed by bonding a fabricated first structure andsecond structure to each other to bond metal layers included in thefirst and second structures to each other.

The first structure may include a transistor including silicon in anactive layer or an active region, a first metal layer electricallyconnected to the transistor, and a first insulating layer.

The second structure may include a photoelectric conversion element, atransistor including an oxide semiconductor in an active layer, a secondmetal layer electrically connected to the transistor, and a secondinsulating layer.

Alternatively, the first structure may include a first transistorincluding silicon in an active layer or an active region, a secondtransistor including an oxide semiconductor in an active layer, a thirdmetal layer electrically connected to the second transistor, and a thirdinsulating layer, and the second structure may include a photoelectricconversion element, a fourth metal layer electrically connected to thephotoelectric conversion element, and a fourth insulating layer.

Alternatively, the first structure, the second structure, and a thirdstructure may be bonded to each other.

In this case, the first structure may include a transistor includingsilicon in an active layer or an active region, a first metal layerelectrically connected to the transistor, and a first insulating layer.The second structure may include a transistor including an oxidesemiconductor in an active layer, a second metal layer electricallyconnected to the transistor, a third metal layer, a second insulatinglayer, and a third insulating layer. The third structure may include aphotoelectric conversion element, a fourth metal layer electricallyconnected to the photoelectric conversion element, and a fourthinsulating layer.

The transistor including the oxide semiconductor in an active layer hasa low off-state current and therefore facilitates construction of amemory for retaining data in the pixel of an imaging device.

FIGS. 1A and 1B are a cross-sectional schematic view of a pixel 20included in an imaging device of one embodiment of the present inventionand a circuit diagram thereof, respectively. Note that an example inwhich transistors are n-channel transistors is illustrated in FIGS. 1A,1B, and the like; however, one embodiment of the present invention isnot limited to this, and some transistors may be replaced with p-channeltransistors.

In the pixel 20, one electrode of a photoelectric conversion element PDis electrically connected to one of a source and a drain of a transistor41. The other of the source and the drain of the transistor 41 iselectrically connected to one of a source and a drain of a transistor42. The other of the source and the drain of the transistor 41 iselectrically connected to a gate of a transistor 43. One of a source anda drain of the transistor 43 is electrically connected to one of asource and a drain of a transistor 44.

Here, a node FD to which the other of the source and the drain of thetransistor 41, one of the source and the drain of the transistor 42, andthe gate of the transistor 43 are connected is a charge detectionportion. Note that a capacitor may be connected to the node FD asillustrated in FIG. 20A.

In FIGS. 1A and 1B, the other electrode of the photoelectric conversionelement PD is electrically connected to a wiring 71 (VPD). The other ofthe source and the drain of the transistor 42 is electrically connectedto a wiring 72 (VRS). The other of the source and the drain of thetransistor 43 is electrically connected to a wiring 73 (VPI). The otherof the source and the drain of the transistor 44 is electricallyconnected to a wiring 91 (OUT1).

Note that connection configuration between a component (e.g., atransistor, a photoelectric conversion element, or the like) and awiring in FIGS. 1A and 1B is an example. Components might beelectrically connected to different wirings, or a plurality ofcomponents might be electrically connected to the same wiring.

The wiring 71 (VPD), the wiring 72 (VRS), and the wiring 73 (VPI) canfunction as power supply lines. For example, the wiring 71 (VPD) canfunction as a low potential power supply line. The wiring 72 (VRS) andthe wiring 73 (VPI) can function as high potential power supply lines.

A gate of the transistor 41 is electrically connected to a wiring 61(TX). A gate of the transistor 42 is electrically connected to a wiring62 (RS). A gate of the transistor 44 is electrically connected to awiring 63 (SE).

The wirings 61 (TX), 62 (RS), and 63 (SE) can function as signal linesfor controlling the conduction states of the transistors to which therespective wirings are connected.

The transistor 41 can function as a transistor for transferring thepotential of a cathode of the photoelectric conversion element PD. Thetransistor 42 can function as a transistor for resetting the potentialof the node FD. The transistor 43 can function as a transistor foroutputting a signal corresponding to the potential of the node FD. Thetransistor 44 can function as a transistor for selecting the pixel 20.

Note that the above structure of the pixel 20 is just an example, andsome of the circuits, some of the transistors, some of the capacitors,some of the wirings, or the like are not included in some cases.Alternatively, a circuit, a transistor, a capacitor, a wiring, or thelike that is not included in the above structure might be included.Alternatively, a connection configuration of some wirings might bedifferent from the above configuration.

An imaging device of one embodiment of the present invention includes alayer 1100, a layer 1200, and a layer 1300 as illustrated in FIG. 1A.

The layer 1100 may include the photoelectric conversion element PD. Aphotodiode with two terminals can be used for the photoelectricconversion element PD, for example. As the photodiode, a PN photodiodeusing a single crystal silicon substrate, a PIN photodiode using anamorphous silicon thin film, a micro crystal silicon thin film, or apolycrystalline silicon thin film, selenium or a compound thereof, or aphotodiode using an organic compound can be used.

The layer 1200 may include the transistors 41 and 42. As the transistors41 and 42, a transistor including an oxide semiconductor in an activelayer (hereinafter, referred to as an OS transistor) is preferably used.In addition, the layer 1200 includes a metal layer 401 b electricallyconnected to one of the source and the drain of the transistor 41 andone of the source and the drain of the transistor 42.

An OS transistor has an extremely low off-state current. A period duringwhich charge can be held in the node FD can be extremely long owing tothe low off-state current of the transistors 41 and 42. Therefore, aglobal shutter system in which charge accumulation operation isperformed in all the pixels at the same time can be used without acomplicated circuit configuration and an operation method. Note that theimaging device of one embodiment of the present invention can also beoperated in a rolling shutter system.

The OS transistor has lower temperature dependence of change inelectrical characteristics than a transistor including silicon in anactive region or an active layer (hereinafter, referred to as a Sitransistor), and thus can be used in an extremely wide range oftemperatures. Therefore, an imaging device and a semiconductor devicewhich include the OS transistors are suitable for use in automobiles,aircrafts, and spacecrafts.

Moreover, the OS transistor has higher drain withstand voltage than theSi transistor. To utilize avalanche multiplication, a photoelectricconversion element including a selenium-based material in aphotoelectric conversion layer is preferably operated while a relativelyhigh voltage (e.g., 10 V or more) is applied. Therefore, by combinationof the OS transistor and the photoelectric conversion element in whichthe selenium-based material is used for the photoelectric conversionlayer, a highly reliable imaging device can be obtained.

The layer 1300 may include the transistors 43 and 44. As the transistors43 and 44, a transistor including silicon in an active layer or anactive region is preferably used. Such a transistor has a high on-statecurrent and efficiently amplifies the potential of the node FD.Moreover, the layer 1200 includes a metal layer 401 a electricallyconnected to the gate of the transistor 44.

As illustrated in FIG. 1A, the metal layers 401 a and 401 b are providedin a position to be in contact with each other directly and include aconnection portion 401 at which the metal layers 401 a and 401 b areelectrically connected to each other.

Alternatively, the imaging device of one embodiment of the presentinvention may have a structure illustrated in FIG. 2A.

In a structure illustrated in FIG. 2A, the layer 1100 includes thephotoelectric conversion element PD, a metal layer 402 b electricallyconnected to one electrode of the photoelectric conversion element PD,and a metal layer 403 b electrically connected to the other electrode ofthe photoelectric conversion element PD. Note that the metal layer 403 bis not necessarily provided in the layer 1100.

The layer 1200 includes the transistor 41, the transistor 42, a metallayer 402 a electrically connected to one of the source and the drain ofthe transistor 41, and a metal layer 403 a electrically connected to thewiring 71. Note that the wiring 71 and the metal layer 403 a are notnecessarily provided in the layer 1200.

The layer 1300 includes the transistors 43 and 44.

As illustrated in FIG. 2A, the metal layers 402 a and 402 b are providedin a position to be in contact with each other directly and include aconnection portion 402 at which the metal layers 402 a and 402 b areelectrically connected to each other. Furthermore, the metal layers 403a and 403 b are provided in a position to be in contact with each otherdirectly and include a connection portion 403 at which the metal layers403 a and 403 b are electrically connected to each other.

An imaging device of one embodiment of the present invention may have astructure illustrated in FIG. 2B.

In a structure illustrated in FIG. 2B, the layer 1100 includes thephotoelectric conversion element PD, a metal layer 402 b electricallyconnected to one electrode of the photoelectric conversion element PD,and a metal layer 403 b electrically connected to the other electrode ofthe photoelectric conversion element PD. Note that the metal layer 403 bis not necessarily provided in the layer 1100.

The layer 1200 includes the transistor 41, the transistor 42, the metallayer 402 a electrically connected to one of the source and the drain ofthe transistor 41, the metal layer 403 a electrically connected to thewiring 71, and the metal layer 401 b electrically connected to one ofthe source and the drain of each of the transistors 41 and 42. Note thatthe wiring 71 and the metal layer 403 a is not necessarily provided inthe layer 1200.

The layer 1300 includes the transistors 43 and 44 and the metal layer401 a electrically connected to the gate of the transistor 43.

As illustrated in FIG. 2B, the metal layers 402 a and 402 b are providedin a position to be in contact with each other directly and include theconnection portion 402 at which the metal layers 402 a and 402 b areelectrically connected to each other. Furthermore, the metal layers 403a and 403 b are provided in a position to be in contact with each otherdirectly and include the connection portion 403 at which the metallayers 403 a and 403 b are electrically connected to each other.Moreover, the metal layers 401 a and 401 b are provided in a position tobe in contact with each other directly and include the connectionportion 401 at which the metal layers 401 a and 401 b are electricallyconnected to each other.

FIGS. 3A, 3B, and 3C each illustrate a specific structure of the pixel20 corresponding to FIG. 1A. FIG. 3A is a cross-sectional view of thetransistors 41 to 44 in the channel length direction. FIG. 3B is across-sectional view which is taken along dashed-dotted line X1-X2 inFIG. 3A and which illustrates a cross section of the transistor 41 inthe channel width direction. FIG. 3C is a cross-sectional view which istaken along dashed-dotted line Y1-Y2 in FIG. 3A and which illustrates across section of the transistor 42 in the channel width direction.

Although the wirings, the electrodes, the metal layers, and contactplugs (conductors 82) are illustrated as independent components in thecross-sectional views in this embodiment, some of them are provided asone component in some cases when they are electrically connected to eachother. In addition, a structure in which the components such as wirings,electrodes, and metal layers are connected to each other through theconductors 82 is only an example, and the components may be directlyconnected to each other not through the conductor 82.

Insulating layers 81 a to 81 j each functioning as a protective film, aninterlayer insulating film, or a planarization film are provided overthe components such as transistors. For example, an inorganic insulatingfilm such as a silicon oxide film or a silicon oxynitride film can beused as the insulating layers 81 a to 81 j. Alternatively, an organicinsulating film such as an acrylic resin film or a polyimide resin filmmay be used. Top surfaces of the insulating layers 81 a to 81 j arepreferably subjected to planarization treatment as necessary by chemicalmechanical polishing (CMP) or the like.

In some cases, one or more of the wirings and the like illustrated inthe drawing are not provided, or a wiring, a transistor, or the likethat is not illustrated in the drawing is included in each layer. Insome cases, a layer that is not illustrated in the drawing is included.Furthermore, one or more of the layers illustrated in the drawing arenot included in some cases.

Insulating layers 80 a and 80 b are provided between a region includingan OS transistor and a region including a Si device (a Si transistor ora Si photodiode).

Dangling bonds of silicon are terminated with hydrogen in insulatinglayers provided in the vicinities of the active regions of thetransistors 43 and 44. Therefore, the hydrogen has an effect ofimproving the reliability of the transistors 43 and 44. Meanwhile,hydrogen in insulating layers which are provided in the vicinity of theoxide semiconductor layer that is the active layer of the transistors 41and 42 causes generation of carriers in the oxide semiconductor layer.Therefore, the hydrogen might reduce the reliability of the transistors41 and 42. For this reason, the insulating layer 80 b that has afunction of preventing diffusion of hydrogen is preferably providedbetween one layer including the Si transistor and another layer stackedthereover that includes the OS transistor. Hydrogen is confined in onelayer by the insulating layer 80 b, so that the reliability of thetransistors 43 and 44 can be improved. Furthermore, diffusion ofhydrogen from the one layer to the other layer is inhibited, so that thereliability of the transistors 41 and 42 can also be improved. For thisreason, the insulating layer 80 a that has a function of preventingdiffusion of hydrogen is preferably provided between one layer includingthe Si photodiode and another layer including the OS transistor.

The insulating layers 80 a and 80 b can be, for example, formed using,aluminum oxide, aluminum oxynitride, gallium oxide, gallium oxynitride,yttrium oxide, yttrium oxynitride, hafnium oxide, hafnium oxynitride, oryttria-stabilized zirconia (YSZ).

In FIG. 3A, the photoelectric conversion element PD included in thelayer 1100 is a PN photodiode using a single crystal silicon substrate.The photoelectric conversion element PD may include a p^(□) region 620,a p⁻ region 630, an n-type region 640, and a p^(□) region 650.

The n-type region 640 is electrically connected to a metal layer 405.The p^(□) region 650 is electrically connected to a metal layer 406. Themetal layers 405 and 406 are provided to penetrate an insulating layer81 g.

The transistors 41 and 42 which are OS transistors are provided in thelayer 1200. Although each of the transistors 41 and 42 includes a backgate, only the transistor 41 may include a back gate, for example. Asillustrated in FIG. 3B, the back gate might be electrically connected toa front gate of the transistor, which is provided to face the back gate.Alternatively, different fixed potentials might be supplied to the backgate and the front gate.

The metal layer 401 b includes a region embedded in an insulating layer81 d and the metal layer 401 b is electrically connected to the other ofthe source and the drain of the transistor 41 and one of the source andthe drain of the transistor 42 through a conductive layer, the conductor82, or the like. One of the source and the drain of the transistor 41 iselectrically connected to the metal layer 405 through the conductivelayer, the conductor 82, or the like. In addition, the wiring 71 iselectrically connected to the metal layer 406 through the conductor 82.

The transistors 43 and 44 which are Si transistors are provided in thelayer 1300. Although FIG. 3A shows the transistors 43 and 44 of a fintype, the transistors may be of a planar type as illustrated in FIG. 4A.Alternatively, as illustrated in FIG. 4B, transistors each including anactive layer 660 formed using a silicon thin film may be used. Theactive layer 660 can be formed using polycrystalline silicon or singlecrystal silicon of a silicon-on-insulator (SOI) structure.

The metal layer 401 a includes a region embedded in an insulating layer81 c and the metal layer 401 a is electrically connected to the gate ofthe transistor 43 through the conductive layer, the conductor 82, or thelike.

The metal layers 401 a and 401 b are preferably formed using metalelements using the same main component. Moreover, the insulating layers81 c and 81 d are preferably formed using the same component.

For example, Cu, Al, Sn, Zn, W, Ag, Pt, Au, or the like can be used forthe metal layers 401 a and 401 b. Preferably, Cu, Al, W, or Au is usedfor easy bonding. In addition, silicon oxide, silicon oxynitride,silicon nitride oxide, silicon nitride, titanium nitride, or the likecan be used for the insulating layers 81 c and 81 d.

When the above same metal materials and the above insulating materialsare used for the metal layers 401 a and 401 b and the insulating layers81 c and 81 d, respectively, a bonding step can be performed at abonding portion a in FIG. 3. The metal layers 401 a and 401 b can beelectrically connected to each other through the bonding step.Furthermore, the connection between the insulating layers 81 c and 81 dcan obtain mechanical strength.

For bonding the metal layers to each other, surface activated bondingand diffusion bonding can be used. Surface activated bonding is a methodin which an oxide film and a layer adsorbing impurities over the surfaceof the metal layer are removed by sputtering treatment and the cleanedand activated surfaces of the metal layers are made to be in contactwith each other to be bonded to each other. Diffusion bonding is amethod in which the surfaces of the metal layers are bonded to eachother by using temperature and pressure together. Both methods can causebonding at an atomic level, thereby obtaining not only electric but alsomechanical strength.

For bonding the insulating layers to each other, hydrophilic bonding orthe like can be used after obtaining high planarity by polishing or thelike. Hydrophilic bonding is the following method: the surfaces of themetal layers are subjected to hydrophilicity treatment by oxygen plasmaor the like, made to be in contact with each other to be bonded to eachother temporarily, and then dehydrated by heat treatment so that finalbonding is performed. Also the hydrophilic bonding can cause bonding atan atomic level; thus, the connection can obtain mechanical strength.

The insulating layers and the metal layers are mixed on the bondingsurfaces of the layers 1300 and 1200; therefore, surface activatedbonding and hydrophilic bonding are preferably performed together whenthe layers 1300 and 1200 are bonded to each other.

For example, the following method can be used: the surfaces of thelayers 1300 and 1200 are made clean after polishing, the surfaces of themetal layers are subjected to antioxidant treatment and hydrophilicitytreatment, and then bonding is performed. Alternatively, hydrophilicitytreatment may be performed on the surfaces of the metal layers with theuse of hardly oxidizable metal such as Au. Note that a bonding methodother than the above method may be used.

Bonding is performed after the devices are completed, so that OStransistors and Si transistors can be fabricated using an optimalprocess for each of them. Therefore, the electric characteristics andreliability of the transistors can be improved. Moreover, bonding isperformed after top-gate transistors are completed, so that front gateelectrodes of the OS transistors and gate electrodes of the Sitransistors are provided so that top surfaces thereof face each other.

Alternatively, the pixel 20 may have a stacked structure illustrated inFIG. 5. The pixel 20 in FIG. 5 is different from that in FIG. 3A only inthe structure of the layer 1100 and the other structures are the same.

In FIG. 5, the photoelectric conversion element PD included in the layer1100 is a photodiode using selenium for a photoelectric conversionlayer. The photoelectric conversion element PD may include aphotoelectric conversion layer 561, a light-transmitting conductivelayer 562, an electrode 566, a partition wall 567, and a wiring 571.

The electrode 566 is electrically connected to the metal layer 405. Thelight-transmitting conductive layer 562 is electrically connected to themetal layer 406 through the wiring 571. The metal layers 405 and 406 areprovided to penetrate the insulating layer 81 g.

FIG. 5 illustrates the photoelectric conversion element PD including aselenium-based material for the photoelectric conversion layer 561. Thephotoelectric conversion element PD including a selenium-based materialhas high external quantum efficiency with respect to visible light.Furthermore, the selenium-based material has a high light-absorptioncoefficient, making the photoelectric conversion layer 561 thin easily.The photoelectric conversion element PD including a selenium-basedmaterial can be a highly sensitive sensor in which the amount ofamplification of electrons is large because of avalanche multiplication.In other words, the use of a selenium-based material for thephotoelectric conversion layer 561 allows a sufficient amount ofphotocurrent to be obtained even when the pixel area is reduced. Thus,the photoelectric conversion element PD including a selenium-basedmaterial is also suitable for imaging in a low-illuminance environment.

Amorphous selenium or crystalline selenium can be used as aselenium-based material. Crystalline selenium can be obtained by, forexample, depositing amorphous selenium and then performing heattreatment. When the crystal grain size of crystalline selenium issmaller than a pixel pitch, variation in characteristics between pixelscan be reduced. Moreover, crystalline selenium has higher spectralsensitivity to visible light and light-absorption coefficient forvisible light than those of amorphous selenium.

Although the photoelectric conversion layer 561 is a single layer inFIG. 5, gallium oxide, cerium oxide, an In—Ga—Zn oxide, or the like maybe provided as a hole-blocking layer 568 on a light-receiving surfaceside as illustrated in FIG. 6A. Alternatively, as illustrated in FIG.6B, nickel oxide, antimony sulfide, or the like may be provided as anelectron injection blocking layer 569 on the electrode 566 side.Alternatively, as illustrated in FIG. 6C, the hole-blocking layer 568and the electron injection blocking layer 569 may be provided.

The photoelectric conversion layer 561 may be a layer including acompound of copper, indium, and selenium (CIS). Alternatively, a layerincluding a compound of copper, indium, gallium, and selenium (CIGS) maybe used. A photoelectric conversion element including the CIS layer orthe CIGS layer can also utilize avalanche multiplication like thephotoelectric conversion element including a layer of selenium alone.

In the photoelectric conversion element PD using the selenium-basedmaterial, for example, the photoelectric conversion layer 561 can beprovided between the electrode 566 formed using a metal material or thelike and the light-transmitting conductive layer 562. Furthermore, CISand CIGS are p-type semiconductors, and an n-type semiconductor such ascadmium sulfide or zinc sulfide may be provided in contact with thep-type semiconductor in order to form a junction.

Although the light-transmitting conductive layer 562 is directly incontact with the wiring 571 in FIG. 5, they may be in contact with eachother through a wiring 588 as illustrated in FIG. 6D. Although thephotoelectric conversion layer 561 and the light-transmitting conductivelayer 562 are not divided between pixel circuits in FIG. 5, they may bedivided between circuits as illustrated in FIG. 6E. In a region betweenpixels where the electrode 566 is not provided, the partition wall 567formed of an insulator is preferably provided, thereby preventinggeneration of a crack in the photoelectric conversion layer 561 and thelight-transmitting conductive layer 562. However, the partition wall 567is not necessarily provided as illustrated in FIGS. 7A and 7B.

The electrode 566, the wiring 571, and the like may be a multilayer. Forexample, as illustrated in FIG. 7C, the electrode 566 can include twoconductive layers 566 a and 566 b and the wiring 571 can include twoconductive layers 571 a and 571 b. In the structure in FIG. 7C, forexample, the conductive layers 566 a and 571 a may be made of alow-resistance metal or the like, and the conductive layers 566 b and571 b may be made of a metal or the like that exhibits an excellentcontact property with the photoelectric conversion layer 561. Such astructure improves the electrical properties of the photoelectricconversion element PD. Note that some kinds of metal may causeelectrochemical corrosion by being in contact with thelight-transmitting conductive layer 562. Even when such a metal is usedin the conductive layer 571 a, electrochemical corrosion can beprevented by the conductive layer 571 b.

The conductive layers 566 b and 571 b can be formed using, for example,molybdenum, tungsten, or the like. The conductive layers 566 a and 571 acan be formed using, for example, aluminum, titanium, or a stack oftitanium, aluminum, and titanium that are stacked in that order.

As illustrated in FIG. 7D, the light-transmitting conductive layer 562may be connected to the wiring 571 through the conductor 82 and thewiring 588.

The partition wall 567 can be formed using an inorganic insulator, aninsulating organic resin, or the like. The partition wall 567 may becolored black or the like in order to shield the transistors and thelike from light and/or to determine the area of a light-receivingportion in each pixel.

Alternatively, the pixel 20 may have a stacked structure illustrated inFIG. 8A. The pixel 20 in FIG. 8A is different from the pixel 20 in FIG.3A only in the structure of the layer 1100 and the other structures arethe same.

In FIG. 8A, the photoelectric conversion element PD included in thelayer 1100 is a PIN photodiode using an amorphous silicon film or amicrocrystalline silicon film in a photoelectric conversion layer. Thephotoelectric conversion element PD may include an n-type semiconductorlayer 565, an i-type semiconductor layer 564, a p-type semiconductorlayer 563, the electrode 566, the wiring 571, and the wiring 588.

The electrode 566 is electrically connected to the metal layer 405. Thep-type semiconductor layer 563 is electrically connected to the metallayer 406 through the wirings 588 and 571. The metal layers 405 and 406are provided to penetrate the insulating layer 81 g.

The i-type semiconductor layer 564 is preferably formed using amorphoussilicon. The p-type semiconductor layer 563 and the n-type semiconductorlayer 565 can each be formed using amorphous silicon, microcrystallinesilicon, or the like that includes a dopant imparting the correspondingconductivity type. A photodiode in which a photoelectric conversionlayer is formed using amorphous silicon has high sensitivity in avisible light wavelength region, and therefore can easily sense weakvisible light.

FIGS. 8B to 8D show other examples of the structure of the photoelectricconversion element PD having a structure of a PIN thin film photodiodeand the connection configuration between the photoelectric conversionelement PD and the wirings. Note that the structure and the connectionconfiguration are not limited to the above examples, and otherconfigurations may be applied.

FIG. 8B illustrates a structure of the photoelectric conversion elementPD that includes the light-transmitting conductive layer 562 in contactwith the p-type semiconductor layer 563. The light-transmittingconductive layer 562 serves as an electrode and can increase the outputcurrent of the photoelectric conversion element PD.

For the light-transmitting conductive layer 562, the following can beused: indium tin oxide; indium tin oxide containing silicon; indiumoxide containing zinc; zinc oxide; zinc oxide containing gallium; zincoxide containing aluminum; tin oxide; tin oxide containing fluorine; tinoxide containing antimony; graphene; graphene oxide; or the like. Thelight-transmitting conductive layer 562 is not limited to a singlelayer, and may be a stacked layer of different films.

In the structure of FIG. 8C, the light-transmitting conductive layer 562and the wiring 571 are connected to each other through the conductor 82and the wiring 588. Note that the p-type semiconductor layer 563 of thephotoelectric conversion element PD and the wiring 571 may be connectedto each other through the conductor 82 and the wiring 588. In thestructure of FIG. 8C, the light-transmitting conductive layer 562 is notnecessarily provided.

FIG. 8D illustrates a structure in which an opening exposing the p-typesemiconductor layer 563 is provided in an insulating layer 81 k coveringthe photoelectric conversion element PD, and the light-transmittingconductive layer 562 covering the opening is electrically connected tothe wiring 571.

The photoelectric conversion element PD including the aforementionedselenium-based material, amorphous silicon, or the like can be formedthrough general semiconductor manufacturing processes such as adeposition process, a lithography process, and an etching process. Inaddition, because the resistance of the selenium-based material is high,the photoelectric conversion layer 561 does not need to be dividedbetween circuits as illustrated in FIG. 5. Therefore, the imaging devicein one embodiment of the present invention can be manufactured with ahigh yield at low cost.

Note that the photoelectric conversion element PD included in the pixel20 in FIG. 5 and FIG. 8A is a stack of thin films; thus, thephotoelectric conversion element PD is preferably formed after thebonding step.

Alternatively, the pixel 20 may have a stacked structure illustrated inFIG. 9. In the pixel 20 in FIG. 9, the layer 1200 is formed over thelayer 1300 and the layer 1200 and the layer 1100 which are formedseparately are bonded to each other at a bonding portion b. That is, abonding portion of metal layers is provided between the layers 1300 and1200 in a stacked structure in FIG. 3A and between the layers 1200 and1100 in a stacked structure in FIG. 9.

In FIG. 9, the photoelectric conversion element PD included in the layer1100 is a PN photodiode using a single crystal silicon substrate. Thephotoelectric conversion element PD may include the p^(□) region 620,the p⁻ region 630, the n-type region 640, and the p^(□) region 650.

The n-type region 640 is electrically connected to the metal layer 402b. The p^(□) region 650 is electrically connected to the metal layer 403b. The metal layers 405 and 406 are provided to penetrate an insulatinglayer 81 g.

The metal layers 402 a and 403 a are provided in the layer 1200. Themetal layer 402 a includes a region embedded in an insulating layer 81 hand the metal layer 402 a is electrically connected to one of the sourceand the drain of the transistor 41 through the conductive layer, theconductor 82, or the like. The metal layer 403 a includes a regionembedded in an insulating layer 81 h and the metal layer 403 a iselectrically connected to the wiring 71 through the conductor 82.

The transistors 43 and 44 which are Si transistors are provided in thelayer 1300. The gate of the transistor 43 is electrically connected tothe other of the source and the drain of the transistor 41 and one ofthe source and the drain of the transistor 42 through the conductivelayer, the conductor 82, or the like.

Alternatively, the pixel 20 may have a structure illustrated in FIG. 10.In the pixel 20 in FIG. 10, the layers 1300, 1200 and 1100 are formedseparately and the layers 1300 and 1200 are bonded to each other at thebonding portion a and the layers 1200 and 1100 are bonded to each otherat the bonding portion b. That is, bonding portions of metal layers areprovided between the layers 1300 and 1200 and between the layers 1200and 1100.

In FIG. 10, the photoelectric conversion element PD included in thelayer 1100 is a PN photodiode using a single crystal silicon substrate.The photoelectric conversion element PD may include the p^(□) region620, the p⁻ region 630, the n-type region 640, and the p^(□) region 650.

The n-type region 640 is electrically connected to a metal layer 402 b.The p^(□) region 650 is electrically connected to a metal layer 403 b.The metal layers 402 a and 403 b are provided penetrating an insulatinglayer 81 g.

The metal layers 401 b, 402 a, and 403 a are provided in the layer 1200.The metal layer 401 b includes a region embedded in the insulating layer81 d and the metal layer 401 b is electrically connected to the other ofthe source and the drain of the transistor 41 and one of the source andthe drain of the transistor 42 through the conductive layer, theconductor 82, or the like. The metal layer 402 a includes a regionembedded in an insulating layer 81 g and the metal layer 402 a iselectrically connected to one of the source and the drain of thetransistor 41 through the conductive layer, the conductor 82, or thelike. The metal layer 403 a includes a region embedded in an insulatinglayer 81 g and the metal layer 403 a is electrically connected to thewiring 71 through the conductor 82.

The metal layer 401 a is provided in the layer 1300. The metal layer 401a includes a region embedded in an insulating layer 81 c and the metallayer 401 a is electrically connected to one of the source and the drainof the transistor 41 through the conductive layer, the conductor 82, orthe like.

An example of the method for fabricating the stacked structure in FIG.3A will be described with reference to FIGS. 11A1, 11A2, and 11A3.

First, the layer 1300 including the insulating layer 81 c and the metallayer 401 a in the uppermost layer is formed (see FIG. 11A1). The metallayer 401 a may be formed using the following method, for example: athrough-hole reaching a wiring layer electrically connected to the gateelectrode of the transistor 43 is formed in the insulating layer 81 c, ametal layer is provided by a CVD method, a plating method, or the likeso as to fill the through-hole, and an surplus metal layer is removed bypolishing surface thereof. Alternatively, the following method may beused: the metal layer 401 a is formed in advance by a CVD method, asputtering method, or the like, the insulating layer 81 c is formed tocover the metal layer 401 a, and the top surface of the metal layer 401a is exposed by polishing the surface of the insulating layer 81 c. Inany of the methods, a level difference between the metal layer 401 a andthe insulating layer 81 c is preferably reduced as much as possible byflattening the entire surface of each layer by a CMP method or the like.

Next, the photoelectric conversion element PD is formed and the layer1200 including the insulating layer 81 d and the metal layer 401 b inthe uppermost layer is formed over the photoelectric conversion elementPD.

The photoelectric conversion element PD is formed by, for example,forming an impurity region in a single crystal silicon substrate 670 bya diffusion method, a doping method, or the like. Then, components suchas an OS transistor are electrically connected to each other to beformed and the insulating layer 81 d and the metal layer 401 b areformed in the uppermost layer of the photoelectric conversion elementPD. The metal layer 401 b can be formed in a manner similar to that ofthe metal layer 401 a and the surfaces of the insulating layer 81 d andthe metal layer 401 b are planarized by a CMP method or the like.

Then, the aforementioned treatment before bonding is performed on theplanarized surfaces of the layers 1300 and 1200. Subsequently, bondingis performed after positioning so that the metal layers 401 a and 401 bare in contact with each other and the metal layers 401 a and 401 b andthe insulating layers 81 c and 81 d are bonded to each other by anappropriate process (see FIG. 11A2).

After bonding, an unnecessary region of the single crystal siliconsubstrate 670 is polished to expose a light-receiving surface of thephotoelectric conversion element PD and a protective film such as aninsulating layer is formed as necessary (see FIG. 11A3). Through theabove steps, the stacked structure in FIG. 3A is completed.

Note that polishing of the single crystal silicon substrate 670 may beperformed before the bonding step or forming an OS transistor. In thiscase, polishing is preferably performed using a peelable adhesive or thelike and a support substrate as appropriate.

An example of the method for fabricating the stacked structure in FIG. 5and FIG. 8A will be described with reference to FIGS. 11B1, 11B2, 11B3,and 11B4. Note that the aforementioned fabricating method of the pixel20 in FIG. 3A can be referred to for the fabricating method of the layer1300 and the bonding step of the layers 1300 and 1200.

First, the layer 1300 including the insulating layer 81 c and the metallayer 401 a is formed in the uppermost layer (see FIG. 11B1).

Next, a separation layer 1800 is provided over a flat support substrate1700 such as a glass substrate or a semiconductor substrate, and thelayer 1200 including the insulating layer 81 d and the metal layer 401 bin the uppermost layer is formed over the separation layer 1800.

The separation layer 1800 can be formed using a stack of a tungsten filmand a silicon oxide film, for example. The stack is thermally stable;therefore, separation can be performed in the vicinity of the interfacebetween the tungsten film and the silicon oxide film by applying aphysical force after the manufacturing process of the transistors.Alternatively, a polyimide film may be used as the separation layer1800. In the case of using a polyimide film, a light-transmittingsubstrate is preferably used. Accordingly, the polyimide film is made tobe fragile by a light such as laser light emitted from alight-transmitting substrate side and separation can be performed afterthe manufacturing process of the transistors. Alternatively, a thermallystable peelable adhesive or the like may be used as the separation layer1800.

Then, bonding of the layers 1300 and 1200 is performed (see FIG. 11B2).

After bonding, a stack of the layers 1300 and 1200 is separated from thesupport substrate 1700. When part of the separation layer remains overthe surface of the layer 1200, part of the separation layer is removedby washing, etching, or the like to expose the surfaces of the metallayers 405 and 406 (see FIG. 11B3 and FIG. 3A).

Subsequently, the layer 1100 including the photoelectric conversionelement PD is formed over the layer 1200 (see FIG. 11B4). Through theabove steps, the stacked structure in FIG. 5 or FIG. 8A is completed.

An example of the method for fabricating the stacked structure in FIG. 9will be described with reference to FIGS. 12A1, 12A2, 12A3, and 12A4.Note that the fabricating method of the stacked structure in FIG. 3A canbe referred to for the fabricating method of the metal layers at abonding portion and the bonding method thereof.

First, the layer 1300 is formed (see FIG. 12A1) and the layer 1200including the insulating layer 81 h and the metal layers 402 a and 403 ain the uppermost layer is formed over the layer 1300 (see FIG. 12A2).Then, the components included in the layers 1300 and 1200 areelectrically connected to each other as necessary.

Next, the layer 1200 and the single crystal silicon substrate 670 inwhich the photoelectric conversion element PD is provided are bonded toeach other and the metal layers 402 a and 402 b, the metal layers 403 aand 403 b, and the insulating layers 81 h and 81 g are bonded to eachother (see FIG. 12A3).

After bonding, an unnecessary region of the single crystal siliconsubstrate 670 is polished to expose the light-receiving surface of thephotoelectric conversion element PD and a protective film such as aninsulating layer is formed as necessary (see FIG. 12A4). Through theabove steps, the layer 1100 can be formed and the stacked structure inFIG. 9 is completed.

Note that polishing of the single crystal silicon substrate 670 may beperformed before the bonding step. In this case, polishing is preferablyperformed using a peelable adhesive or the like and a support substrateas appropriate.

An example of the method for fabricating the stacked structure in FIG.10 will be described with reference to FIGS. 12B1, 12B2, 12B3, 12B4 and12B5. Note that the fabricating method of the stacked structure in FIG.3A can be referred to for the fabricating method and the bonding methodof the metal layers at a bonding portion.

First, the layer 1300 including the insulating layer 81 c and the metallayer 401 a in the uppermost layer is formed (see FIG. 12B1).

Next, the separation layer 1800 is provided over the flat supportsubstrate 1700 such as a glass substrate or a semiconductor substrate,and the layer 1200 including the insulating layer 81 g and the metallayers 402 a and 403 a in the lowermost layer and including theinsulating layer 81 d and the metal layer 401 b in the uppermost layeris formed over the separation layer 1800.

Then, bonding of the layers 1300 and 1200 will be performed (see FIG.12B2).

After bonding, a stack of the layers 1300 and 1200 is separated from thesupport substrate 1700. When part of the separation layer remains overthe surface of the layer 1200, part of the separation layer is removedby washing, etching, or the like to expose the surfaces of the metallayers 402 a and 403 a (see FIG. 12B3).

Next, the layer 1200 and the single crystal silicon substrate 670 inwhich the photoelectric conversion element PD is provided are bonded toeach other and the metal layers 402 a and 402 b, the metal layers 403 aand 403 b, and the insulating layers 81 h and 81 g are bonded to eachother (see FIG. 12B4).

After bonding, an unnecessary region of the single crystal siliconsubstrate 670 is polished to expose the light-receiving surface of thephotoelectric conversion element PD and a protective film such as aninsulating layer is formed as necessary (see FIG. 12B5). Through theabove steps, the layer 1100 can be formed and the stacked structure inFIG. 10 is completed.

Note that polishing of the single crystal silicon substrate 670 may beperformed before the bonding step. In this case, polishing is preferablyperformed using a peelable adhesive or the like and a support substrateas appropriate.

Alternatively, in an imaging device of one embodiment of the presentinvention, a circuit different from a pixel circuit can be provided bySi transistors formed in the layer 1300. Examples of the circuit includea driver circuit such as a column driver and a row driver, a dataconverter circuit such as an A/D converter, a noise reduction circuitsuch as a CDS circuit, and a control circuit of a whole imaging device.

A transistor 46 and a transistor 47 included in any of the abovecircuits are illustrated in FIG. 13. The transistors 46 and 47 can beformed in a region overlapping with the photoelectric conversion elementPD. Alternatively, one or both of the transistors 46 and 47 may beformed in a region overlapping with one or both of the transistors 41and 42. That is, the above circuit is formed in a region overlappingwith the pixel 20. Note that although a structure example of a CMOSinverter where the transistor 46 is a p-channel transistor and thetransistor 47 is an n-channel transistor is illustrated in FIG. 13,another circuit configuration may also be employed.

Alternatively, as illustrated in FIG. 14, the transistor 47 may be an OStransistor provided in the layer 1200. In the configuration illustratedin FIG. 14, the transistors 46 and 47 can be provided in a regionoverlapping with each other in a bonding step, so that the area of thecircuit can be reduced. In addition, when p-channel transistors areformed as the transistors 44 and 45 included in the pixel 20, all thetransistors provided over a single-crystal silicon substrate 600 can bep-channel transistors; thus, forming of n-channel Si transistors can beomitted.

Note that although FIG. 13 and FIG. 14 each illustrate the stackedstructure in which the transistors 46 and 47 are added to the pixel 20in FIG. 3A, the transistors 46 and 47 can also be added to the pixel 20in FIG. 5, FIG. 9, or FIG. 10.

FIG. 15A is a block diagram illustrating a circuit configuration of animaging device of one embodiment of the present invention. The imagingdevice includes a pixel array 21 including the pixels 20 arranged in amatrix, a circuit 22 (row driver) having a function of selecting a rowof the pixel array 21, a circuit 23 (CDS circuit) for performingcorrelated double sampling (CDS) on an output signal of the pixel 20, acircuit 24 (A/D converter circuit or the like) having a function ofconverting analog data output from the circuit 23 to digital data, and acircuit 25 (column driver) having a function of selecting and readingdata converted in the circuit 24. Note that a configuration notincluding the circuit 23 can be employed. Furthermore, the circuits 23to 25 are collectively referred to as a circuit 30.

FIG. 15B illustrates a circuit diagram of the circuit 23 and a blockdiagram of the circuit 24; the circuit 23 and the circuit 24 areconnected to one column of the pixel array 21. The circuit 23 caninclude a transistor 51, a transistor 52, a capacitor C3, and acapacitor C4. Furthermore, the circuit 24 can include a comparatorcircuit 27 and a counter circuit 29.

A transistor 53 serves as a current supply circuit. The wiring 91 (OUT1)is electrically connected to one of a source and a drain of thetransistor 53, and a power supply line is connected to the other of thesource and the drain of the transistor 53. As the power supply line, alow potential power supply line (VSS) can be used, for example. Biasvoltage is always applied to a gate of the transistor 53.

In the circuit 23, one of a source and a drain of the transistor 51 iselectrically connected to one of a source and a drain of the transistor52. One of the source and the drain of the transistor 51 is electricallyconnected to one electrode of the capacitor C3. The other of the sourceand the drain of the transistor 52 is electrically connected to oneelectrode of the capacitor C4. The other of the source and the drain ofthe transistor 52 is electrically connected to a wiring 92 (OUT2). Theother of the source and the drain of the transistor 51 is electricallyconnected to a high potential power supply line (CDSVDD) through which areference potential is supplied, for example. The other electrode of thecapacitor C4 is electrically connected to a low potential power supplyline (CDSVSS), for example.

An operation example of the circuit 23 when the circuit 23 is connectedto the pixel 20 in FIG. 1B will be described. First, the transistors 51and 52 are turned on. Next, the potential of imaging data is output fromthe pixel 20 to the wiring 91 (OUT1), and the reference potential(CDSVDD) is held in the wiring 92 (OUT2). Then, the transistor 51 isturned off and a reset potential (here, a potential higher than thepotential of the imaging data, for example, a VDD potential) is outputfrom the pixel 20 to the wiring 91 (OUT1). At this time, the potentialof the wiring 92 (OUT2) is a value obtained by adding the absolute valueof a difference between the potential of the imaging data and the resetpotential to the reference potential (CDSVDD). Thus, a potential signalwith little noise that is obtained by adding the net potential of theimaging data to the reference potential (CDSVDD) can be supplied to thecircuit 24.

In the case where the reset potential is lower than the potential of theimaging data (for example, in the case where the reset potential is apotential GND or the like), the potential of the wiring 92 (OUT2) is avalue obtained by subtracting the absolute value of the differencebetween the potential of the imaging data and the reset potential fromthe reference potential (CDSVDD).

In the circuit 24, a signal potential that is input from the circuit 23to the comparator circuit 27 and a reference potential (RAMP) that isswept to be increased or decreased are compared. Then, in accordancewith the output of the comparator circuit 27, the counter circuit 29operates to output a digital signal to a wiring 93 (OUT3).

In an imaging device of one embodiment of the present invention, astacked structure of the pixel array 21 and a circuit portion 35including the circuit 30 can be employed. For example, a stackedstructure as illustrated in the perspective view in FIG. 16C, whichincludes the pixel array 21 having the top view in FIG. 16A and thecircuit portion 35 having the top view in FIGS. 16B1 and 16B2 can beobtained. With such a structure, transistors suitable for respectiveelements can be used, and the area of the imaging device can be reduced.Note that the layouts of the circuit in FIGS. 16B1 and 16B2 areexamples, and another layout may be used. Although a control circuit 26is provided in the circuit portion 35, the control circuit 26 may beprovided outside the circuit portion 35.

FIG. 16B1 illustrates a structure where the circuits 22 and 30 aredivided into two parts and placed not at the edge portion but near thecenter. Shift register circuits included in the circuits 22 and 30 maybe operated independently in divided portions or operated as one shiftregister circuit.

The circuits 22 and 30 in FIG. 16B2 are divided into two parts in amanner similar to that in FIG. 16B1 but placed obliquely.

With the structure illustrated in FIG. 16B1 or 16B2, loads of thewirings connected to the pixel 20 can be reduced as compared with thecase where the circuits 22 and 30 are placed at the edge portion.Although the loads of the wirings are not uniform, it does not matterwhen wiring capacity and wiring resistance are small.

To achieve both a high-speed operation and the configuration of a CMOScircuit, the circuits 22 and 30 are preferably formed using transistorsincluding silicon (hereinafter, referred to as Si transistors). Forexample, the circuit portion 35 can be formed over a silicon substrate.The pixel array 21 is preferably formed using transistors including anoxide semiconductor (hereinafter, referred to as OS transistors). Notethat some transistors included in the circuits 22 and 30 may be formedusing OS transistors.

FIG. 17A is a cross-sectional view of an example of a mode in which acolor filter and the like are added to an imaging device. Thecross-sectional view illustrates part of a region including pixelcircuits for three pixels. An insulating layer 2500 is formed over thelayer 1100 where the photoelectric conversion element PD is formed. Asthe insulating layer 2500, a silicon oxide film or the like with a highvisible-light transmitting property can be used. In addition, a siliconnitride film may be stacked as a passivation film. In addition, adielectric film of hafnium oxide or the like may be stacked as ananti-reflection film.

A light-blocking layer 2510 may be formed over the insulating layer2500. The light-blocking layer 2510 has a function of inhibiting colormixing of light passing through an upper color filter. Thelight-blocking layer 2510 can be formed of a metal layer of aluminum,tungsten, or the like, or a stack of the metal layer and a dielectricfilm functioning as an anti-reflection film.

An organic resin layer 2520 can be provided as a planarization film overthe insulating layer 2500 and the light-blocking layer 2510. A colorfilter 2530 (a color filter 2530 a, a color filter 2530 b, and a colorfilter 2530 c) is formed in each pixel. For example, the color filter2530 a, the color filter 2530 b, and the color filter 2530 c each have acolor of red (R), green (G), blue (B), yellow (Y), cyan (C), magenta(M), or the like, so that a color image can be obtained.

A light-transmitting insulating layer 2560 or the like can be providedover the color filter 2530.

As illustrated in FIG. 17B, an optical conversion layer 2550 may be usedinstead of the color filter 2530. Such a structure enables an imagingdevice to take images in various wavelength regions.

For example, when a filter that blocks light having a wavelength shorterthan or equal to that of visible light is used as the optical conversionlayer 2550, an infrared imaging device can be obtained. When a filterthat blocks light having a wavelength shorter than or equal to that ofnear infrared light is used as the optical conversion layer 2550, afar-infrared imaging device can be obtained. When a filter that blockslight having a wavelength longer than or equal to that of visible lightis used as the optical conversion layer 2550, an ultraviolet imagingdevice can be obtained.

Furthermore, when a scintillator is used as the optical conversion layer2550, an imaging device that takes an image visualizing the intensity ofradiations and is used for an X-ray imaging device or the like can beobtained. Radiation such as X-rays passes through an object to enter ascintillator, and then is converted into light (fluorescence) such asvisible light or ultraviolet light owing to a phenomenon known asphotoluminescence. Then, the photoelectric conversion element PD detectsthe light to obtain image data. Furthermore, the imaging device havingthe structure may be used in a radiation detector or the like.

A scintillator is formed of a substance that, when irradiated withradiation such as X-rays or gamma-rays, absorbs energy of the radiationto emit visible light or ultraviolet light. For example, a resin orceramics in which any of Gd₂O₂S:Tb, Gd₂O₂S:Pr, Gd₂O₂S:Eu, BaFCl:Eu, NaI,CsI, CaF₂, BaF₂, CeF₃, LiF, LiI, and ZnO is dispersed can be used.

FIG. 47A is a photograph of an X-ray imaging panel fabricated using anOS transistor. The panel size is 100.5 mm×139 mm, the number of pixelsis 384×512, the pixel size is 120 □m×120 □m, the resolution is 106 ppi,and amorphous silicon is used for a photodiode. In addition, a rowdriver for selecting a pixel and a multiplexer for controlling an outputsignal are incorporated in the panel.

FIG. 47B is a photograph obtained by X-ray imaging captured with theX-ray imaging panel to which a scintillator (Gd₂O₂S:Tb) is added. A leadboard, a coin of copper, and a clock whose exterior is a resin areplaced on the panel and irradiated with X-rays from above to obtain animage. The scintillator does not emit light under the lead board whichblocks X-rays, so that the photograph is black. The photograph under thecoin of copper which transmits X-rays more easily than lead is gray. Inaddition, the clock whose exterior is a resin transmits X-rays;therefore, an image of inside metal components is taken.

In the photoelectric conversion element PD using a selenium-basedmaterial, radiation such as X-rays can be directly converted intocharge; thus, the scintillator is not necessarily used.

Alternatively, as illustrated in FIG. 17C, a microlens array 2540 may beprovided over the color filters 2530 a, 2530 b, and 2530 c. Lightpenetrating lenses included in the microlens array 2540 goes through thecolor filters positioned thereunder to reach the photoelectricconversion element PD. Alternatively, as illustrated in FIG. 17D, themicrolens array 2540 may be provided over the optical conversion layer2550. Note that a region other than the layer 1100 in FIGS. 17A to 17Dis referred to as a layer 1600.

FIG. 18 illustrates a specific example of a stacked structure of thepixel 20 of one embodiment of the present invention, the microlens array2540 illustrated in FIG. 17C, and the like. In the example illustratedin FIG. 18, the structure of the pixel 20 illustrated in FIG. 3A isused. In the example illustrated in FIG. 19, the structure of the pixelillustrated in FIG. 9 is used.

The photoelectric conversion element PD and the circuit of the pixel 20can be positioned so as to overlap with each other in this manner,leading to a reduction in the size of the imaging device.

As illustrated in FIG. 18 and FIG. 19, a diffraction grating 1500 may beprovided above the microlens array 2540. An image of an object throughthe diffraction grating 1500 (i.e., a diffraction pattern) can bescanned into a pixel, and an input image (an object image) can be formedfrom a captured image in the pixel by arithmetic processing. Inaddition, the use of the diffraction grating 1500 instead of a lens canreduce the cost of electronic devices or the like including the imagingdevice.

The diffraction grating 1500 can be formed using a light-transmittingmaterial. For example, an inorganic insulating film such as a siliconoxide film or a silicon oxynitride film can be used. Alternatively, anorganic insulating film such as an acrylic resin film or a polyimideresin film may be used. Alternatively, a stack of the inorganicinsulating film and the organic insulating film may be used.

In addition, the diffraction grating 1500 can be formed by a lithographyprocess using a photosensitive resin or the like. Alternatively, thediffraction grating 1500 can be formed by a lithography process and anetching process. Alternatively, the diffraction grating 1500 can beformed by nanoimprint lithography, laser scribing, or the like.

A space X may be provided between the diffraction grating 1500 and themicrolens array 2540. The space X can be less than or equal to 1 mm,preferably less than or equal to 100 □m. The space may be an empty spaceor may be a sealing layer or an adhesion layer formed using alight-transmitting material. For example, an inert gas such as nitrogenor a rare gas can be sealed in the space. Alternatively, an acrylicresin, an epoxy resin, a polyimide resin, or the like may be provided inthe space. Alternatively, a liquid such as silicone oil may be provided.Even in the case where the microlens array 2540 is not provided, thespace X may be provided between the color filter 2530 and thediffraction grating 1500.

The pixel 20 may have a circuit configuration illustrated in FIG. 20B.The connection direction of the photoelectric conversion element PD inthe pixel 20 in FIG. 20B is different from that in the pixel 20 in FIG.1A. In this case, the pixel 20 can be operated when the potentials ofthe wiring 71 (VPD) and the wiring 72 (VRS) in the description of thecircuit in FIG. 1B are reversed.

The transistors 41 to 44 in the pixel 20 may each have a back gate asillustrated in FIG. 21A. FIG. 21A illustrates a configuration ofapplying a constant potential to the back gates, which enables controlof the threshold voltages.

Wirings 75 to 78 connected to the respective back gates can be suppliedwith a different potential separately. Alternatively, as illustrated inFIG. 21B, the wirings connected to the respective back gates of thetransistors 41 and 42 may be electrically connected to each other. Thewirings connected to the back gates of the transistors 43 and 44 may beelectrically connected to each other.

In n-channel transistors, the threshold voltage is shifted in a positivedirection when a potential lower than a source potential is applied to aback gate. In contrast, the threshold voltage is shifted in a negativedirection when a potential higher than a source potential is applied toa back gate. Therefore, in the case where on/off of each of thetransistors is controlled by the predetermined gate voltage, theoff-state current can be reduced when a potential lower than a sourcepotential is applied to a back gate and the on-state current can bereduced when a potential higher than a source potential is applied to aback gate.

The node FD is desired to have high potential retention capability inthe circuits in FIG. 1, FIGS. 20A and 20B, and FIGS. 21A and 21B, sothat OS transistors with a low off-state current are preferably used forthe transistors 41 and 42 as described above. The off-state current canbe reduced when a potential lower than a source potential is applied tothe back gates of the transistors 41 and 42. Therefore, the node FD canhave high potential retention capability.

As described above, Si transistors with a high on-state current arepreferably used for the transistors 43 and 44. The on-state current canbe increased when a potential higher than a source potential is appliedto the back gates of the transistors 43 and 44. Therefore, a readingpotential output to the wiring 91 (OUT1) can be defined immediately,that is, the transistors 43 and 44 can be operated at high frequency.

Note that the same potential may be applied to a front gate and the backgate of the transistor 44 as illustrated in FIG. 21C. Alternatively, thetransistors 43 and 44 may not be Si transistors but OS transistors.Although the on-state current of the OS transistor is relatively low,the on-state current can be increased by providing a back gate, so thatthe OS transistor can be operated at high frequency.

A plurality of potentials such as a signal potential and a potentialapplied to the back gate are used inside an imaging device besides powersupply potentials. Supply of a plurality of potentials from the outsideof an imaging device increases the number of terminals; thus, an imagingdevice preferably has a power supply circuit generating a plurality ofpotentials inside the imaging device.

The operation of the pixel in FIG. 21A will be described using a timingchart in FIG. 22. In the timing chart, “V1” can be a potential higherthan a reference potential, such as a high power supply potential (VDD).“V0” can be a reference potential (source potential) such as 0 V, apotential GND, and a low power supply potential (VS S).

First, at Time T1, the transistors 41 and 42 are turned on and the nodeFD is reset to a reset potential (e.g., VDD) when the potentials of thewiring 75 (RS) and the wiring 61 (TX) are set to “V1” (reset operation).At this time, the on-state current of the transistors 41 and 42 isincreased when the potentials of the wirings 75 and 76 are set topotentials higher than “V0” (>“V0”), so that the reset operation can beperformed immediately.

At Time T2, the transistor 42 is turned off and the reset operation isterminated to start accumulation operation when the potential of thewiring 75 (RS) is set to “V0”. At this time, the off-state current ofthe transistor 42 can be reduced and supply of charge to the node FD byleakage current can be prevented when the potential of the wiring 76 isset to a potential lower than “V0”. Alternatively, at Time T2, thepotential of the wiring 75 may be “V0”.

At Time T3, the transistor 41 is turned off and the potential of thenode FD is defined and held (holding operation) when the potential ofthe wiring 61 (TX) is set to “V0”. At this time, the off-state currentof the transistor 41 can be reduced and leakage of charge from the nodeFD by leakage current can be prevented when the potential of the wiring75 is set to a potential lower than “V0” (<“V0”).

At Time T4, the transistor 44 is turned on and the potential of thewiring 91 (OUT1) changes depending on a current flowing through thetransistor 43 when the potential of the wiring 63(SE) is set to “V1”(reading operation). At this time, the on-state current of thetransistors 43 and 44 is increased and the potential of the wiring 91(OUT1) can be defined immediately when the potentials of the wirings 77and 78 are set to potentials higher than “V0” (>“V0”).

At Time 5, the transistor 44 is turned off when the potential of thewiring 63 (SE) is set to “V0”, so that the reading operation iscompleted. Note that the potentials of the wirings 75 and 76 arepreferably held lower than “V0” (<“V0”) so that the potential of thenode FD does not change until the reading operation is completed.Alternatively, the potentials of the wirings 75 and 76 may be changed atthe same timing in the above description.

Through the above steps, a signal based on the potential of the node FDcan be read. Note that the pixel 20 in FIG. 1A may be operated withoutcontrolling the wirings 75 to 78 in the timing chart in FIG. 22. Thepixel 20 in FIG. 21B may be operated without controlling the wirings 76and 78 in the timing chart in FIG. 22.

In a pixel circuit of one embodiment of the present invention,transistors may be shared among a plurality of pixels as illustrated inFIGS. 23A and 23B.

FIG. 23A illustrates a pixel in which transistors are shared among aplurality of pixels. In the pixel, pixels 20 a to 20 d each include thephotoelectric conversion element PD and the transistor 41 and share thetransistors 42 to 44 and a capacitor C1. The operation of each of thetransistors 41 included in the pixels 20 a to 20 d is controlled bywirings 61 a to 61 d. With this circuit configuration, reset operation,accumulation operation, holding operation, and reading operation can besequentially performed by each pixel. This configuration is mainlysuitable for imaging using a rolling shutter system.

FIG. 23B illustrates a pixel in which transistors are shared among aplurality of pixels. In the pixel, the pixels 20 a to 20 d include thephotoelectric conversion elements PD, the transistors 41, and thetransistors 45 individually and share the transistors 42 to 44 and thecapacitor C1. A potential can be held in the cathode of thephotoelectric conversion element PD by providing the transistor 45,whose operation is controlled by the potential of wiring 65 (GPD),between the photoelectric conversion element PD and the wiring 71 (VPD).This configuration is suitable for imaging using a global shuttersystem, in which reset operation, accumulation operation, and holdingoperation are sequentially performed in all the pixels at the same timeand reading operation is performed by each pixel.

In the pixel circuits illustrated in FIGS. 23A and 23B, the plurality ofpixels (the pixels 20 a to 20 d) aligned in the direction in which thewiring 91 (OUT1) extends (hereinafter, referred to as a verticaldirection) share the transistors; however, a plurality of pixels alignedin the direction in which the wiring 63 (SE) extends (hereinafter,referred to as a horizontal direction) may share transistors.Alternatively, a plurality of pixels aligned in the horizontal andvertical directions may share transistors.

Alternatively, the number of pixels which share transistors is notlimited to four, and may be two, three, or five or more.

Although the wiring 72 (VRS) and the wiring 73 (VPI) are merged into onewiring and the wiring 72 (VRS) is omitted in a configuration in FIGS.23A and 23B, the wiring 72 (VRS) may be included. In addition, althoughthe other electrode of the capacitor C1 is connected to the wiring 73(VPI), the other electrode of the capacitor C1 may be connected to thewiring 71 (VPD).

As illustrated in FIGS. 24A1 and 24B1, the imaging device may be bent.FIG. 24A1 illustrates a state in which the imaging device is bent alongdashed-two dotted line Y1-Y2. FIG. 24A2 is a cross-sectional viewillustrating a portion indicated by dashed-two dotted line X1-X2 in FIG.24A1. FIG. 24A3 is a cross-sectional view illustrating a portionindicated by dashed-two dotted line Y1-Y2 in FIG. 24A1.

FIG. 24B1 illustrates a state where the imaging device is bent alongdashed-two dotted line X3-X4 and dashed-two dotted line Y3-Y4. FIG. 24B2is a cross-sectional view illustrating a portion indicated by dashed-twodotted line X3-X4 in FIG. 24B1. FIG. 24B3 is a cross-sectional viewillustrating a portion indicated by dashed-two dotted line Y3-Y4 in FIG.24B1.

The bent imaging device enables the curvature of field and astigmatismto be reduced. Thus, the optical design of lens and the like, which isused in combination with the imaging device, can be facilitated. Forexample, the number of lenses used for aberration correction can bereduced; accordingly, the size or weight of semiconductor devicesincluding the imaging device can be easily reduced. In addition, thequality of a captured image can be improved.

In this embodiment, one embodiment of the present invention has beendescribed. Other embodiments of the present invention are described inother embodiments. Note that one embodiment of the present invention isnot limited thereto. In other words, various embodiments of theinvention are described in this embodiment and the other embodiments,and one embodiment of the present invention is not limited to aparticular embodiment. Although an example in which one embodiment ofthe present invention is applied to an imaging device is described, oneembodiment of the present invention is not limited thereto. Depending oncircumstances or conditions, one embodiment of the present invention isnot necessarily applied to an imaging device. One embodiment of thepresent invention may be applied to a semiconductor device with anotherfunction, for example. Although an example in which a channel formationregion, a source region, a drain region, or the like of a transistorincludes an oxide semiconductor is described as one embodiment of thepresent invention, one embodiment of the present invention is notlimited thereto. Depending on circumstances or conditions, varioustransistors or a channel formation region, a source region, a drainregion, or the like of a transistor in one embodiment of the presentinvention may include various semiconductors. Depending on circumstancesor conditions, various transistors or a channel formation region, asource region, a drain region, or the like of a transistor in oneembodiment of the present invention may include, for example, at leastone of silicon, germanium, silicon germanium, silicon carbide, galliumarsenide, aluminum gallium arsenide, indium phosphide, gallium nitride,and an organic semiconductor. Alternatively, for example, depending oncircumstances or conditions, various transistors or a channel formationregion, a source region, a drain region, or the like of a transistor inone embodiment of the present invention does not necessarily include anoxide semiconductor. Although an example in which a global shuttersystem is employed is described as one embodiment of the presentinvention, one embodiment of the present invention is not limitedthereto. Depending on circumstances or conditions, another system suchas a rolling shutter system may be employed in one embodiment of thepresent invention. Alternatively, depending on circumstances orconditions, the global shutter system is not necessarily employed.

This embodiment can be implemented in appropriate combinations with theconfigurations described in the other embodiments.

Embodiment 2

In this embodiment, an OS transistor that can be used in one embodimentof the present invention will be described with reference to drawings.In the drawings in this embodiment, some components are enlarged,reduced in size, or omitted for easy understanding.

FIGS. 25A and 25B are a top view and a cross-sectional view illustratinga transistor 101 of one embodiment of the present invention. FIG. 25A isthe top view, and FIG. 25B illustrates a cross section in the directionof dashed-dotted line B1-B2 in FIG. 25A. A cross section in thedirection of dashed-dotted line B3-B4 in FIG. 25A is illustrated in FIG.27A. The direction of dashed-dotted line B1-B2 is referred to as achannel length direction, and the direction of dashed-dotted line B3-B4is referred to as a channel width direction.

The transistor 101 includes an insulating layer 120 in contact with asubstrate 115; an oxide semiconductor layer 130 in contact with theinsulating layer 120; conductive layers 140 and 150 electricallyconnected to the oxide semiconductor layer 130; an insulating layer 160in contact with the oxide semiconductor layer 130 and the conductivelayers 140 and 150; a conductive layer 170 in contact with theinsulating layer 160; an insulating layer 175 in contact with theconductive layers 140 and 150, the insulating layer 160, and theconductive layer 170; and an insulating layer 180 in contact with theinsulating layer 175. The insulating layer 180 may function as aplanarization film as necessary.

The conductive layer 140, the conductive layer 150, the insulating layer160, and the conductive layer 170 can function as a source electrodelayer, a drain electrode layer, a gate insulating film, and a gateelectrode layer, respectively.

A region 231, a region 232, and a region 233 in FIG. 25B can function asa source region, a drain region, and a channel formation region,respectively. The region 231 and the region 232 are in contact with theconductive layer 140 and the conductive layer 150, respectively. When aconductive material that is easily bonded to oxygen is used for theconductive layers 140 and 150, the resistance of the regions 231 and 232can be reduced.

Specifically, since the oxide semiconductor layer 130 is in contact withthe conductive layers 140 and 150, an oxygen vacancy is generated in theoxide semiconductor layer 130, and interaction between the oxygenvacancy and hydrogen that remains in the oxide semiconductor layer 130or diffuses into the oxide semiconductor layer 130 from the outsidechanges the regions 231 and 232 to n-type regions with low resistance.

Note that functions of a “source” and a “drain” of a transistor aresometimes interchanged with each other when a transistor of oppositepolarity is used or when the direction of current flow is changed in acircuit operation, for example. Therefore, the terms “source” and“drain” can be interchanged with each other in this specification. Inaddition, the term “electrode layer” can be replaced with the term“wiring”.

The conductive layer 170 includes two layers, a conductive layer 171 anda conductive layer 172, in the drawing, but also may be a single layeror a stack of three or more layers. The same can apply to othertransistors described in this embodiment.

Each of the conductive layers 140 and 150 is a single layer in thedrawing, but also may be a stack of two or more layers. The same canapply to other transistors described in this embodiment.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 25C and 25D. FIG. 25C is a top view of atransistor 102. A cross section in the direction of dashed-dotted lineC1-C2 in FIG. 25C is illustrated in FIG. 25D. A cross section in thedirection of dashed-dotted line C3-C4 in FIG. 25C is illustrated in FIG.27B. The direction of dashed-dotted line C1-C2 is referred to as achannel length direction, and the direction of dashed-dotted line C3-C4is referred to as a channel width direction.

The transistor 102 has the same structure as the transistor 101 exceptthat an end portion of the insulating layer 160 functioning as a gateinsulating film is not aligned with an end portion of the conductivelayer 170 functioning as a gate electrode layer. In the transistor 102,wide areas of the conductive layers 140 and 150 are covered with theinsulating layer 160 and accordingly the resistance between theconductive layer 170 and the conductive layers 140 and 150 is high;therefore, the transistor 102 has a feature of a low gate leakagecurrent.

The transistors 101 and 102 each have a top-gate structure including aregion where the conductive layer 170 overlaps with the conductivelayers 140 and 150. To reduce parasitic capacitance, the width of theregion in the channel length direction is preferably greater than orequal to 3 nm and less than 300 nm. Since an offset region is not formedin the oxide semiconductor layer 130 in this structure, a transistorwith a high on-state current can be easily formed.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 25E and 25F. FIG. 25E is a top view of atransistor 103. A cross section in the direction of dashed-dotted lineD1-D2 in FIG. 25E is illustrated in FIG. 25F. A cross section in thedirection of dashed-dotted line D3-D4 in FIG. 25E is illustrated in FIG.27A. The direction of dashed-dotted line D1-D2 is referred to as achannel length direction, and the direction of dashed-dotted line D3-D4is referred to as a channel width direction.

The transistor 103 includes the insulating layer 120 in contact with thesubstrate 115; the oxide semiconductor layer 130 in contact with theinsulating layer 120; the insulating layer 160 in contact with the oxidesemiconductor layer 130; the conductive layer 170 in contact with theinsulating layer 160; the insulating layer 175 covering the oxidesemiconductor layer 130, the insulating layer 160, and the conductivelayer 170; the insulating layer 180 in contact with the insulating layer175; and the conductive layers 140 and 150 electrically connected to theoxide semiconductor layer 130 through openings provided in theinsulating layers 175 and 180. The transistor 103 may further include,for example, an insulating layer (planarization film) in contact withthe insulating layer 180 and the conductive layers 140 and 150 asnecessary.

The conductive layer 140, the conductive layer 150, the insulating layer160, and the conductive layer 170 can function as a source electrodelayer, a drain electrode layer, a gate insulating film, and a gateelectrode layer, respectively.

The region 231, the region 232, and the region 233 in FIG. 25F canfunction as a source region, a drain region, and a channel formationregion, respectively. The regions 231 and 232 are in contact with theinsulating layer 175. When an insulating material containing hydrogen isused for the insulating layer 175, for example, the resistance of theregions 231 and 232 can be reduced.

Specifically, interaction between an oxygen vacancy generated in theregions 231 and 232 by the steps up to formation of the insulating layer175 and hydrogen that diffuses into the regions 231 and 232 from theinsulating layer 175 changes the regions 231 and 232 to n-type regionswith low resistance. As the insulating material containing hydrogen, forexample, silicon nitride, aluminum nitride, or the like can be used.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 26A and 26B. FIG. 26A is a top view of atransistor 104. A cross section in the direction of dashed-dotted lineE1-E2 in FIG. 26A is illustrated in FIG. 26B. A cross section in thedirection of dashed-dotted line E3-E4 in FIG. 26A is illustrated in FIG.27A. The direction of dashed-dotted line E1-E2 is referred to as achannel length direction, and the direction of dashed-dotted line E3-E4is referred to as a channel width direction.

The transistor 104 has the same structure as the transistor 103 exceptthat the conductive layers 140 and 150 are in contact with the oxidesemiconductor layer 130 so as to cover end portions of the oxidesemiconductor layer 130.

In FIG. 26B, regions 331 and 334 can function as a source region,regions 332 and 335 can function as a drain region, and a region 333 canfunction as a channel formation region.

The resistance of the regions 331 and 332 can be reduced in a mannersimilar to that of the regions 231 and 232 in the transistor 101.

The resistance of the regions 334 and 335 can be reduced in a mannersimilar to that of the regions 231 and 232 in the transistor 103. In thecase where the length of the regions 334 and 335 in the channel lengthdirection is less than or equal to 100 nm, preferably less than or equalto 50 nm, a gate electric field prevents a significant decrease inon-state current. Therefore, a reduction in resistance of the regions334 and 335 is not performed in some cases.

The transistors 103 and 104 each have a self-aligned structure that doesnot include a region where the conductive layer 170 overlaps with theconductive layers 140 and 150. A transistor with a self-alignedstructure, which has extremely low parasitic capacitance between a gateelectrode layer and source and drain electrode layers, is suitable forapplications that require high-speed operation.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 26C and 26D. FIG. 26C is a top view of atransistor 105. A cross section in the direction of dashed-dotted lineF1-F2 in FIG. 26C is illustrated in FIG. 26D. A cross section in thedirection of dashed-dotted line F3-F4 in FIG. 26C is illustrated in FIG.27A. The direction of dashed-dotted line F1-F2 is referred to as achannel length direction, and the direction of dashed-dotted line F3-F4is referred to as a channel width direction.

The transistor 105 includes the insulating layer 120 in contact with thesubstrate 115; the oxide semiconductor layer 130 in contact with theinsulating layer 120; conductive layers 141 and 151 electricallyconnected to the oxide semiconductor layer 130; the insulating layer 160in contact with the oxide semiconductor layer 130 and the conductivelayers 141 and 151; the conductive layer 170 in contact with theinsulating layer 160; the insulating layer 175 in contact with the oxidesemiconductor layer 130, the conductive layers 141 and 151, theinsulating layer 160, and the conductive layer 170; the insulating layer180 in contact with the insulating layer 175; and conductive layers 142and 152 electrically connected to the conductive layers 141 and 151,respectively, through openings provided in the insulating layers 175 and180. The transistor 105 may further include, for example, an insulatinglayer in contact with the insulating layer 180 and the conductive layers142 and 152 as necessary.

The conductive layers 141 and 151 are in contact with the top surface ofthe oxide semiconductor layer 130 and are not in contact with sidesurfaces of the oxide semiconductor layer 130.

The transistor 105 has the same structure as the transistor 101 exceptthat the conductive layers 141 and 151 are provided, that the openingsare provided in the insulating layers 175 and 180, and that theconductive layers 142 and 152 electrically connected to the conductivelayers 141 and 151, respectively, through the openings are provided. Theconductive layer 140 (the conductive layers 141 and 142) can function asa source electrode layer, and the conductive layer 150 (the conductivelayers 151 and 152) can function as a drain electrode layer.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 26E and 26F. FIG. 26E is a top view of atransistor 106. A cross section in the direction of dashed-dotted lineG1-G2 in FIG. 26E is illustrated in FIG. 26F. A cross section in thedirection of dashed-dotted line G3-G4 in FIG. 26E is illustrated in FIG.27A. The direction of dashed-dotted line G1-G2 is referred to as achannel length direction, and the direction of dashed-dotted line G3-G4is referred to as a channel width direction.

The transistor 106 includes the insulating layer 120 in contact with thesubstrate 115; the oxide semiconductor layer 130 in contact with theinsulating layer 120; the conductive layers 141 and 151 electricallyconnected to the oxide semiconductor layer 130; the insulating layer 160in contact with the oxide semiconductor layer 130; the conductive layer170 in contact with the insulating layer 160; the insulating layer 175in contact with the insulating layer 120, the oxide semiconductor layer130, the conductive layers 141 and 151, the insulating layer 160, andthe conductive layer 170; the insulating layer 180 in contact with theinsulating layer 175; and the conductive layers 142 and 152 electricallyconnected to the conductive layers 141 and 151, respectively, throughopenings provided in the insulating layers 175 and 180. The transistor106 may further include, for example, an insulating layer (planarizationfilm) in contact with the insulating layer 180 and the conductive layers142 and 152 as necessary.

The conductive layers 141 and 151 are in contact with the top surface ofthe oxide semiconductor layer 130 and are not in contact with sidesurfaces of the oxide semiconductor layer 130.

The transistor 106 has the same structure as the transistor 103 exceptthat the conductive layers 141 and 151 are provided. The conductivelayer 140 (the conductive layers 141 and 142) can function as a sourceelectrode layer, and the conductive layer 150 (the conductive layers 151and 152) can function as a drain electrode layer.

In the structures of the transistors 105 and 106, the conductive layers140 and 150 are not in contact with the insulating layer 120. Thesestructures make the insulating layer 120 less likely to be deprived ofoxygen by the conductive layers 140 and 150 and facilitate oxygen supplyfrom the insulating layer 120 to the oxide semiconductor layer 130.

An impurity for forming an oxygen vacancy to increase conductivity maybe added to the regions 231 and 232 in the transistor 103 and theregions 334 and 335 in the transistors 104 and 106. As an impurity forforming an oxygen vacancy in an oxide semiconductor layer, for example,one or more of the following can be used: phosphorus, arsenic, antimony,boron, aluminum, silicon, nitrogen, helium, neon, argon, krypton, xenon,indium, fluorine, chlorine, titanium, zinc, and carbon. As a method foradding the impurity, plasma treatment, ion implantation, ion doping,plasma immersion ion implantation, or the like can be used.

When the above element is added as an impurity element to the oxidesemiconductor layer, a bond between a metal element and oxygen in theoxide semiconductor layer is cut, so that an oxygen vacancy is formed.Interaction between an oxygen vacancy in the oxide semiconductor layerand hydrogen that remains in the oxide semiconductor layer or is addedto the oxide semiconductor layer later can increase the conductivity ofthe oxide semiconductor layer.

When hydrogen is added to an oxide semiconductor in which an oxygenvacancy is formed by addition of an impurity element, hydrogen enters anoxygen vacant site and forms a donor level in the vicinity of theconduction band. Consequently, an oxide conductor can be formed. Here,an oxide conductor refers to an oxide semiconductor having become aconductor. Note that the oxide conductor has a light-transmittingproperty like the oxide semiconductor.

The oxide conductor is a degenerated semiconductor and it is suggestedthat the conduction band edge equals or substantially equals the Fermilevel. For that reason, an ohmic contact is made between an oxideconductor layer and conductive layers functioning as a source electrodelayer and a drain electrode layer; thus, contact resistance between theoxide conductor layer and the conductive layers functioning as a sourceelectrode layer and a drain electrode layer can be reduced.

The transistor in one embodiment of the present invention may includethe conductive layer 173 between the oxide semiconductor layer 130 andthe substrate 115 as illustrated in cross-sectional views in the channellength direction in FIGS. 28A to 28F and cross-sectional views in thechannel width direction in FIGS. 27C and 27D. When the conductive layeris used as a second gate electrode layer (back gate), the on-statecurrent can be increased or the threshold voltage can be controlled. Inthe cross-sectional views in FIGS. 28A to 28F, the width of theconductive layer 173 may be shorter than that of the oxide semiconductorlayer 130. Moreover, the width of the conductive layer 173 may beshorter than that of the conductive layer 170.

In order to increase the on-state current, for example, the conductivelayers 170 and 173 are made to have the same potential, and thetransistor is driven as a double-gate transistor. Furthermore, in orderto control the threshold voltage, a fixed potential that is differentfrom the potential of the conductive layer 170 is applied to theconductive layer 173. To set the conductive layers 170 and 173 at thesame potential, for example, as illustrated in FIG. 27D, the conductivelayers 170 and 173 may be electrically connected to each other through acontact hole.

Although the transistors 101 to 106 in FIGS. 25A to 25F and FIGS. 26A to26F are examples in which the oxide semiconductor layer 130 is a singlelayer, the oxide semiconductor layer 130 may be a stacked layer. Theoxide semiconductor layer 130 in the transistors 101 to 106 can bereplaced with the oxide semiconductor layer 130 in FIGS. 29B and 29C orFIGS. 29D and 29E.

FIG. 29A is a top view of the oxide semiconductor layer 130, and FIGS.29B and 29C are cross-sectional views of the oxide semiconductor layer130 with a two-layer structure. FIGS. 29D and 29E are cross-sectionalviews of the oxide semiconductor layer 130 with a three-layer structure.

Oxide semiconductor layers with different compositions, for example, canbe used as an oxide semiconductor layer 130 a, an oxide semiconductorlayer 130 b, and an oxide semiconductor layer 130 c.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 30A and 30B. FIG. 30A is a top view of atransistor 107. A cross section in the direction of dashed-dotted lineH1-H2 in FIG. 30A is illustrated in FIG. 30B. A cross section in thedirection of dashed-dotted line H3-H4 in FIG. 30A is illustrated in FIG.32A. The direction of dashed-dotted line H1-H2 is referred to as achannel length direction, and the direction of dashed-dotted line H3-H4is referred to as a channel width direction.

The transistor 107 includes the insulating layer 120 in contact with thesubstrate 115; a stack of the oxide semiconductor layers 130 a and 130 bin contact with the insulating layer 120; the conductive layers 140 and150 electrically connected to the stack; the oxide semiconductor layer130 c in contact with the stack and the conductive layers 140 and 150;the insulating layer 160 in contact with the oxide semiconductor layer130 c; the conductive layer 170 in contact with the insulating layer160; the insulating layer 175 in contact with the conductive layers 140and 150, the oxide semiconductor layer 130 c, the insulating layer 160,and the conductive layer 170; and the insulating layer 180 in contactwith the insulating layer 175. The insulating layer 180 may function asa planarization film as necessary.

The transistor 107 has the same structure as the transistor 101 exceptthat the oxide semiconductor layer 130 includes two layers (the oxidesemiconductor layers 130 a and 130 b) in the regions 231 and 232, thatthe oxide semiconductor layer 130 includes three layers (the oxidesemiconductor layers 130 a to 130 c) in the region 233, and that part ofthe oxide semiconductor layer (the oxide semiconductor layer 130 c)exists between the insulating layer 160 and the conductive layers 140and 150.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 30C and 30D. FIG. 30C is a top view of atransistor 108. A cross section in the direction of dashed-dotted lineI1-I2 in FIG. 30C is illustrated in FIG. 30D. A cross section in thedirection of dashed-dotted line I3-I4 in FIG. 30C is illustrated in FIG.32B. The direction of dashed-dotted line I1-I2 is referred to as achannel length direction, and the direction of dashed-dotted line I3-I4is referred to as a channel width direction.

The transistor 108 differs from the transistor 107 in that end portionsof the insulating layer 160 and the oxide semiconductor layer 130 c arenot aligned with the end portion of the conductive layer 170.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 30E and 30F. FIG. 30E is a top view of atransistor 109. A cross section in the direction of dashed-dotted lineJ1-J2 in FIG. 30E is illustrated in FIG. 30F. A cross section in thedirection of dashed-dotted line J3-J4 in FIG. 30E is illustrated in FIG.32A. The direction of dashed-dotted line J1-J2 is referred to as achannel length direction, and the direction of dashed-dotted line J3-J4is referred to as a channel width direction.

The transistor 109 includes the insulating layer 120 in contact with thesubstrate 115; a stack of the oxide semiconductor layers 130 a and 130 bin contact with the insulating layer 120; the oxide semiconductor layer130 c in contact with the stack; the insulating layer 160 in contactwith the oxide semiconductor layer 130 c; the conductive layer 170 incontact with the insulating layer 160; the insulating layer 175 coveringthe stack, the oxide semiconductor layer 130 c, the insulating layer160, and the conductive layer 170; the insulating layer 180 in contactwith the insulating layer 175; and the conductive layers 140 and 150electrically connected to the stack through openings provided in theinsulating layers 175 and 180. The transistor 109 may further include,for example, an insulating layer (planarization film) in contact withthe insulating layer 180 and the conductive layers 140 and 150 asnecessary.

The transistor 109 has the same structure as the transistor 103 exceptthat the oxide semiconductor layer 130 includes two layers (the oxidesemiconductor layers 130 a and 130 b) in the regions 231 and 232 andthat the oxide semiconductor layer 130 includes three layers (the oxidesemiconductor layers 130 a to 130 c) in the region 233.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 31A and 31B. FIG. 31A is a top view of atransistor 110. A cross section in the direction of dashed-dotted lineK1-K2 in FIG. 31A is illustrated in FIG. 31B. A cross section in thedirection of dashed-dotted line K3-K4 in FIG. 31A is illustrated in FIG.32A. The direction of dashed-dotted line K1-K2 is referred to as achannel length direction, and the direction of dashed-dotted line K3-K4is referred to as a channel width direction.

The transistor 110 has the same structure as the transistor 104 exceptthat the oxide semiconductor layer 130 includes two layers (the oxidesemiconductor layers 130 a and 130 b) in the regions 331 and 332 andthat the oxide semiconductor layer 130 includes three layers (the oxidesemiconductor layers 130 a to 130 c) in the region 333.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 31C and 31D. FIG. 31C is a top view of atransistor 111. A cross section in the direction of dashed-dotted lineL1-L2 in FIG. 31C is illustrated in FIG. 31D. A cross section in thedirection of dashed-dotted line L3-L4 in FIG. 31C is illustrated in FIG.32A. The direction of dashed-dotted line L1-L2 is referred to as achannel length direction, and the direction of dashed-dotted line L3-L4is referred to as a channel width direction.

The transistor 111 includes the insulating layer 120 in contact with thesubstrate 115; a stack of the oxide semiconductor layers 130 a and 130 bin contact with the insulating layer 120; the conductive layers 141 and151 electrically connected to the stack; the oxide semiconductor layer130 c in contact with the stack and the conductive layers 141 and 151;the insulating layer 160 in contact with the oxide semiconductor layer130 c; the conductive layer 170 in contact with the insulating layer160; the insulating layer 175 in contact with the stack, the conductivelayers 141 and 151, the oxide semiconductor layer 130 c, the insulatinglayer 160, and the conductive layer 170; the insulating layer 180 incontact with the insulating layer 175; and the conductive layers 142 and152 electrically connected to the conductive layers 141 and 151,respectively, through openings provided in the insulating layers 175 and180. The transistor 111 may further include, for example, an insulatinglayer (planarization film) in contact with the insulating layer 180 andthe conductive layers 142 and 152 as necessary.

The transistor 111 has the same structure as the transistor 105 exceptthat the oxide semiconductor layer 130 includes two layers (the oxidesemiconductor layers 130 a and 130 b) in the regions 231 and 232, thatthe oxide semiconductor layer 130 includes three layers (the oxidesemiconductor layers 130 a to 130 c) in the region 233, and that part ofthe oxide semiconductor layer (the oxide semiconductor layer 130 c)exists between the insulating layer 160 and the conductive layers 141and 151.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 31E and 31F. FIG. 31E is a top view of atransistor 112. A cross section in the direction of dashed-dotted lineM1-M2 in FIG. 31E is illustrated in FIG. 31F. A cross section in thedirection of dashed-dotted line M3-M4 in FIG. 31E is illustrated in FIG.32A. The direction of dashed-dotted line M1-M2 is referred to as achannel length direction, and the direction of dashed-dotted line M3-M4is referred to as a channel width direction.

The transistor 112 has the same structure as the transistor 106 exceptthat the oxide semiconductor layer 130 includes two layers (the oxidesemiconductor layers 130 a and 130 b) in the regions 331, 332, 334, and335 and that the oxide semiconductor layer 130 includes three layers(the oxide semiconductor layers 130 a to 130 c) in the region 333.

The transistor in one embodiment of the present invention may includethe conductive layer 173 between the oxide semiconductor layer 130 andthe substrate 115 as illustrated in cross-sectional views in the channellength direction in FIGS. 33A to 33F and cross-sectional views in thechannel width direction in FIGS. 32C and 32D. When the conductive layeris used as a second gate electrode layer (back gate), the on-statecurrent can be further increased or the threshold voltage can becontrolled. In the cross-sectional views in FIGS. 33A to 33F, the widthof the conductive layer 173 may be shorter than that of the oxidesemiconductor layer 130. Moreover, the width of the conductive layer 173may be shorter than that of the conductive layer 170.

The transistor in one embodiment of the present invention may have astructure illustrated in FIGS. 34A and 34B. FIG. 34A is a top view andFIG. 34B is a cross-sectional view taken along dashed-dotted line N1-N2and dashed-dotted line N3-N4 in FIG. 34A. Note that for simplificationof the drawing, some components are not illustrated in the top view inFIG. 34A.

A transistor 113 illustrated in FIGS. 34A and 34B includes the substrate115, the insulating layer 120 over the substrate 115, the oxidesemiconductor layer 130 (the oxide semiconductor layer 130 a, the oxidesemiconductor layer 130 b, and the oxide semiconductor layer 130 c) overthe insulating layer 120, the conductive layers 140 and 150 that are incontact with the oxide semiconductor layer 130 and are apart from eachother, the insulating layer 160 in contact with the oxide semiconductorlayer 130 c, and the conductive layer 170 in contact with the insulatinglayer 160. Note that the oxide semiconductor layer 130, the insulatinglayer 160, and the conductive layer 170 are provided in an opening thatis provided in an insulating layer 190 over the transistor 113 andreaches the oxide semiconductor layers 130 a and 130 b and theinsulating layer 120.

The transistor 113 has a smaller region in which a conductor serving asa source electrode or a drain electrode overlaps with a conductorserving as a gate electrode than the other transistors described above;thus, the parasitic capacitance in the transistor 113 can be reduced.Therefore, the transistor 113 is preferable as a component of a circuitfor which high-speed operation is needed. As illustrated in FIG. 34B, atop surface of the transistor 113 is preferably planarized by a chemicalmechanical polishing (CMP) method or the like, but is not necessarilyplanarized.

As shown in the top views in FIGS. 35A and 35B (showing only the oxidesemiconductor layer 130, the conductive layer 140, and the conductivelayer 150), the widths (W_(SD)) of the conductive layer 140 (sourceelectrode layer) and the conductive layer 150 (drain electrode layer) inthe transistor of one embodiment of the present invention may be eitherlonger than or shorter than the width (W_(OS)) of the oxidesemiconductor layer 130. When W_(OS)≥W_(SD) (W_(SD) is less than orequal to W_(OS)) is satisfied, a gate electric field is easily appliedto the entire oxide semiconductor layer 130, so that electricalcharacteristics of the transistor can be improved. As illustrated inFIG. 35C, the conductive layers 140 and 150 may be formed only in aregion that overlaps with the oxide semiconductor layer 130.

In the transistor in one embodiment of the present invention (any of thetransistors 101 to 113), the conductive layer 170 functioning as a gateelectrode layer electrically surrounds the oxide semiconductor layer 130in the channel width direction with the insulating layer 160 functioningas a gate insulating film positioned therebetween. This structureincreases the on-state current. Such a transistor structure is referredto as a surrounded channel (s-channel) structure.

In the transistor including the oxide semiconductor layers 130 a and 130b and the transistor including the oxide semiconductor layers 130 a to130 c, selecting appropriate materials for the two or three layersforming the oxide semiconductor layer 130 allows current to flow in theoxide semiconductor layer 130 b. Since current flows in the oxidesemiconductor layer 130 b, the current is hardly influenced by interfacescattering, leading to a high on-state current. Thus, increasing thethickness of the oxide semiconductor layer 130 b improves the on-statecurrent in some cases.

With the above structure, the electrical characteristics of thetransistor can be improved.

The structures described in this embodiment can be used in appropriatecombination with any of the structures described in the otherembodiments.

Embodiment 3

In this embodiment, components of the transistors described inEmbodiment 2 are described in detail.

As the substrate 115, a glass substrate, a quartz substrate, asemiconductor substrate, a ceramic substrate, a metal substrate with aninsulated surface, or the like can be used. Alternatively, a siliconsubstrate provided with a transistor, a photodiode, or the like can beused, and an insulating layer, a wiring, a conductor functioning as acontact plug, and the like may be provided over the silicon substrate.Note that when p-channel transistors are formed using the siliconsubstrate, a silicon substrate with n⁻-type conductivity is preferablyused. Alternatively, an SOI substrate including an n⁻-type or i-typesilicon layer may be used. In the case where a p-channel transistor isformed on the silicon substrate, it is preferable to use a siliconsubstrate in which a plane where the transistor is formed is a (110)plane orientation. Forming a p-channel transistor with the (110) planecan increase mobility.

The insulating layer 120 can have a function of supplying oxygen to theoxide semiconductor layer 130 as well as a function of preventingdiffusion of impurities from a component included in the substrate 115.For this reason, the insulating layer 120 is preferably an insulatingfilm containing oxygen and further preferably, the insulating layer 120is an insulating film containing oxygen in which the oxygen content ishigher than that in the stoichiometric composition. The insulating layer120 is a film in which the amount of released oxygen when converted intooxygen atoms is preferably greater than or equal to 1.0×10¹⁹ atoms/cm³in TDS analysis. In the TDS analysis, the film surface temperature ishigher than or equal to 100 □C and lower than or equal to 700 □C, orhigher than or equal to 100 □C and lower than or equal to 500 □C. In thecase where the substrate 115 is provided with another device, theinsulating layer 120 also has a function of an interlayer insulatingfilm. In that case, the insulating layer 120 is preferably subjected toplanarization treatment such as CMP treatment so as to have a flatsurface.

For example, the insulating layer 120 can be formed using an oxideinsulating film including aluminum oxide, magnesium oxide, siliconoxide, silicon oxynitride, gallium oxide, germanium oxide, yttriumoxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide,tantalum oxide, or the like; a nitride insulating film including siliconnitride, silicon nitride oxide, aluminum nitride, aluminum nitrideoxide, or the like; or a mixed material of any of these. The insulatinglayer 120 may be a stack of any of the above materials.

The oxide semiconductor layer 130 can have a three-layer structure inwhich the oxide semiconductor layers 130 a to 130 c are sequentiallystacked from the insulating layer 120 side.

Note that in the case where the oxide semiconductor layer 130 is asingle layer, a layer corresponding to the oxide semiconductor layer 130b described in this embodiment is used.

In the case where the oxide semiconductor layer 130 has a two-layerstructure, a stack in which layers corresponding to the oxidesemiconductor layer 130 a and the oxide semiconductor layer 130 b aresequentially stacked from the insulating layer 120 side is used. In sucha case, the oxide semiconductor layers 130 a and 130 b can be replacedwith each other.

For the oxide semiconductor layer 130 b, for example, an oxidesemiconductor whose electron affinity (an energy difference between avacuum level and the conduction band minimum) is higher than those ofthe oxide semiconductor layers 130 a and 130 c is used.

In such a structure, when an electric field is applied to the conductivelayer 170, a channel is formed in the oxide semiconductor layer 130 bwhose conduction band minimum is the lowest in the oxide semiconductorlayer 130. Therefore, the oxide semiconductor layer 130 b can beregarded as having a region serving as a semiconductor, while the oxidesemiconductor layer 130 a and the oxide semiconductor layer 130 c can beregarded as having a region serving as an insulator or a semi-insulator.

An oxide semiconductor that can be used for each of the oxidesemiconductor layers 130 a to 130 c preferably contains at least In orZn. Both In and Zn are preferably contained. In order to reducevariations in electrical characteristics of the transistor including theoxide semiconductor, the oxide semiconductor preferably contains astabilizer such as Al, Ga, Y, or Sn in addition to In and Zn.

The oxide semiconductor layers 130 a to 130 c preferably include crystalparts. In particular, when crystals with c-axis alignment are used, thetransistor can have stable electrical characteristics. Moreover,crystals with c-axis alignment are resistant to bending; therefore,using such crystals can improve the reliability of a semiconductordevice using a flexible substrate.

As the conductive layer 140 functioning as a source electrode layer andthe conductive layer 150 functioning as a drain electrode layer, forexample, a single layer or a stacked layer formed using a materialselected from Al, Cr, Cu, Ta, Ti, Mo, W, Ni, Mn, Nd, and Sc and alloysor conductive nitrides of any of these metal materials can be used. Itis also possible to use a stack of any of the above materials and Cu oran alloy such as Cu—Mn, which has low resistance. In the transistors105, 106, 111, and 112, for example, it is possible to use W for theconductive layers 141 and 151 and use a stack of Ti and Al for theconductive layers 142 and 152.

The above materials are capable of extracting oxygen from an oxidesemiconductor film. Therefore, in a region of the oxide semiconductorfilm that is in contact with any of the above materials, oxygen isreleased from the oxide semiconductor layer and an oxygen vacancy isformed. Hydrogen slightly contained in the layer and the oxygen vacancyare bonded to each other, so that the region is markedly changed to ann-type region. Accordingly, the n-type region can serve as a source or adrain of the transistor.

In the case where W is used for the conductive layers 140 and 150, theconductive layers 140 and 150 may be doped with nitrogen. Doping withnitrogen can appropriately lower the capability of extracting oxygen andprevent the n-type region from spreading to a channel region. It ispossible to prevent the n-type region from spreading to a channel regionalso by using a stack of W and an n-type semiconductor layer as theconductive layers 140 and 150 and putting the n-type semiconductor layerin contact with the oxide semiconductor layer. As the n-typesemiconductor layer, an In—Ga—Zn oxide, zinc oxide, indium oxide, tinoxide, indium tin oxide, or the like to which nitrogen is added can beused.

The insulating layer 160 functioning as a gate insulating film can beformed using an insulating film containing one or more of aluminumoxide, magnesium oxide, silicon oxide, silicon oxynitride, siliconnitride oxide, silicon nitride, gallium oxide, germanium oxide, yttriumoxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide,and tantalum oxide. The insulating layer 160 may be a stack of any ofthe above materials. The insulating layer 160 may contain La, N, Zr, orthe like as an impurity.

An example of a stacked-layer structure of the insulating layer 160 isdescribed. The insulating layer 160 includes, for example, oxygen,nitrogen, silicon, or hafnium. Specifically, the insulating layer 160preferably includes hafnium oxide and silicon oxide or siliconoxynitride.

Hafnium oxide and aluminum oxide have higher dielectric constants thansilicon oxide and silicon oxynitride. Therefore, the insulating layer160 using hafnium oxide or aluminum oxide can have larger thickness thanthe insulating layer 160 using silicon oxide, so that leakage currentdue to tunnel current can be reduced. That is, a transistor with a lowoff-state current can be provided. Moreover, hafnium oxide with acrystalline structure has a higher dielectric constant than hafniumoxide with an amorphous structure. Therefore, it is preferable to usehafnium oxide with a crystalline structure in order to provide atransistor with a low off-state current. Examples of the crystallinestructure include a monoclinic crystal structure and a cubic crystalstructure. Note that one embodiment of the present invention is notlimited to these examples.

For the insulating layers 120 and 160 in contact with the oxidesemiconductor layer 130, a film that releases less nitrogen oxide ispreferably used. In the case where the oxide semiconductor is in contactwith an insulating layer that releases a large amount of nitrogen oxide,the density of states due to nitrogen oxide increases in some cases. Forthe insulating layers 120 and 160, for example, an oxide insulatinglayer such as a silicon oxynitride film or an aluminum oxynitride filmthat releases less nitrogen oxide can be used.

A silicon oxynitride film that releases less nitrogen oxide is a filmthat releases ammonia more than nitrogen oxide in TDS; the amount ofreleased ammonia is typically greater than or equal to 1×10¹⁸ cm^(□3)and less than or equal to 5×10¹⁹ cm^(□3). Note that the amount ofreleased ammonia is the amount of ammonia released by heat treatmentwith which the surface temperature of the film becomes higher than orequal to 50 □C and lower than or equal to 650 □C, preferably higher thanor equal to 50 □C and lower than or equal to 550 □C.

By using the above oxide insulating layer for the insulating layers 120and 160, a shift in the threshold voltage of the transistor can bereduced, which leads to reduced fluctuations in the electricalcharacteristics of the transistor.

For the conductive layer 170 functioning as a gate electrode layer, forexample, a conductive film formed using Al, Ti, Cr, Co, Ni, Cu, Y, Zr,Mo, Ru, Ag, Mn, Nd, Sc, Ta, or W can be used. Alternatively, an alloy ora conductive nitride of any of these materials may be used.Alternatively, a stack of a plurality of materials selected from thesematerials, alloys of these materials, and conductive nitrides of thesematerials may be used. Typically, tungsten, a stack of tungsten andtitanium nitride, a stack of tungsten and tantalum nitride, or the likecan be used. Alternatively, Cu or an alloy such as Cu—Mn, which has lowresistance, or a stack of any of the above materials and Cu or an alloysuch as Cu—Mn may be used. In this embodiment, tantalum nitride is usedfor the conductive layer 171 and tungsten is used for the conductivelayer 172 to form the conductive layer 170.

As the conductive layer 170, an oxide conductive layer of an In—Ga—Znoxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, or thelike may be used.

As the insulating layer 175, a silicon nitride film, an aluminum nitridefilm, or the like containing hydrogen can be used. In the transistors103, 104, 106, 109, 110, and 112 described in Embodiment 2, when aninsulating film containing hydrogen is used as the insulating layer 175,part of the oxide semiconductor layer can have n-type conductivity. Inaddition, a nitride insulating film functions as a blocking film againstmoisture and the like and can improve the reliability of the transistor.

An aluminum oxide film can also be used as the insulating layer 175. Itis particularly preferable to use an aluminum oxide film as theinsulating layer 175 in the transistors 101, 102, 105, 107, 108, and 111described in Embodiment 2. The aluminum oxide film has a significanteffect of blocking both oxygen and impurities such as hydrogen andmoisture. Accordingly, during and after the manufacturing process of thetransistor, the aluminum oxide film can suitably function as aprotective film that has effects of preventing entry of impurities suchas hydrogen and moisture into the oxide semiconductor layer 130,preventing release of oxygen from the oxide semiconductor layer, andpreventing unnecessary release of oxygen from the insulating layer 120.

The insulating layer 180 is preferably formed over the insulating layer175. The insulating layer 180 can be formed using an insulating filmcontaining one or more of magnesium oxide, silicon oxide, siliconoxynitride, silicon nitride oxide, silicon nitride, gallium oxide,germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide,neodymium oxide, hafnium oxide, and tantalum oxide. The insulating layer180 may be a stack of any of the above materials.

Here, like the insulating layer 120, the insulating layer 180 preferablycontains oxygen more than that in the stoichiometric composition. Oxygenreleased from the insulating layer 180 can be diffused into the channelformation region in the oxide semiconductor layer 130 through theinsulating layer 160, so that oxygen vacancies formed in the channelformation region can be filled with oxygen. In this manner, stableelectrical characteristics of the transistor can be achieved.

High integration of a semiconductor device requires miniaturization of atransistor. However, that miniaturization of a transistor tends to causedeterioration of electrical characteristics of the transistor. Forexample, a decrease in channel width causes a reduction in on-statecurrent.

In the transistors 107 to 112 in one embodiment of the presentinvention, the oxide semiconductor layer 130 c is formed to cover theoxide semiconductor layer 130 b where a channel is formed; thus, achannel formation layer is not in contact with the gate insulating film.Accordingly, scattering of carriers at the interface between the channelformation layer and the gate insulating film can be reduced and theon-state current of the transistor can be increased.

In the transistor in one embodiment of the present invention, asdescribed above, the gate electrode layer (the conductive layer 170) isformed to electrically surround the oxide semiconductor layer 130 in thechannel width direction; accordingly, a gate electric field is appliedto the oxide semiconductor layer 130 in a direction perpendicular to itsside surface in addition to a direction perpendicular to its topsurface. In other words, a gate electric field is applied to the entirechannel formation layer and an effective channel width is increased,leading to a further increase in on-state current.

Although the variety of films such as the metal films, the semiconductorfilms, and the inorganic insulating films that are described in thisembodiment typically can be formed by sputtering or plasma-enhanced CVD,such films may be formed by another method such as thermal CVD. Examplesof the thermal CVD include metal organic chemical vapor deposition(MOCVD) and atomic layer deposition (ALD).

Since plasma is not used for deposition, thermal CVD has an advantagethat no defect due to plasma damage is generated.

Deposition by thermal CVD may be performed in such a manner that asource gas and an oxidizer are supplied to the chamber at the same time,the pressure in the chamber is set to an atmospheric pressure or areduced pressure, and reaction is caused in the vicinity of thesubstrate or over the substrate.

Deposition by ALD is performed in such a manner that the pressure in achamber is set to an atmospheric pressure or a reduced pressure, sourcegases for reaction are introduced into the chamber and reacted, and thenthe sequence of gas introduction is repeated. An inert gas (e.g., argonor nitrogen) may be introduced as a carrier gas with the source gases.For example, two or more kinds of source gases may be sequentiallysupplied to the chamber. In that case, after reaction of a first sourcegas, an inert gas is introduced, and then a second source gas isintroduced so that the source gases are not mixed. Alternatively, thefirst source gas may be exhausted by vacuum evacuation instead ofintroduction of the inert gas, and then the second source gas may beintroduced. The first source gas is adsorbed on the surface of thesubstrate and reacted to form a first layer, and then, the second sourcegas introduced is adsorbed and reacted. As a result, a second layer isstacked over the first layer, so that a thin film is formed. Thesequence of gas introduction is controlled and repeated more than onceuntil desired thickness is obtained, so that a thin film with excellentstep coverage can be formed. The thickness of the thin film can beadjusted by the number of repetition times of the sequence of gasintroduction; therefore, ALD makes it possible to accurately adjustthickness and thus is suitable for manufacturing a minute FET.

The variety of films such as the metal film, the semiconductor film, andthe inorganic insulating film that have been disclosed in the aboveembodiments can be formed by thermal CVD such as MOCVD or ALD. Forexample, in the case where an In—Ga—Zn—O film is formed, trimethylindium(In(CH₃)₃), trimethylgallium (Ga(CH₃)₃), and dimethylzinc (Zn(CH₃)₂) canbe used. Without limitation to the above combination, triethylgallium(Ga(C₂H₅)₃) can be used instead of trimethylgallium and diethylzinc(Zn(C₂H₅)₂) can be used instead of dimethylzinc.

For example, in the case where a hafnium oxide film is formed by adeposition apparatus using ALD, two kinds of gases, i.e., ozone (O₃) asan oxidizer and a source gas that is obtained by vaporizing liquidcontaining a solvent and a hafnium precursor (hafnium alkoxide and ahafnium amide such as tetrakis(dimethylamide)hafnium (TDMAH,Hf[N(CH₃)₂]₄) and tetrakis(ethylmethylamide)hafnium) are used.

For example, in the case where an aluminum oxide film is formed by adeposition apparatus using ALD, two kinds of gases, i.e., H₂O as anoxidizer and a source gas that is obtained by vaporizing liquidcontaining a solvent and an aluminum precursor (e.g., trimethylaluminum(TMA, Al(CH₃)₃)) are used. Examples of another material includetris(dimethylamide)aluminum, triisobutylaluminum, and aluminumtris(2,2,6,6-tetramethyl-3,5-heptanedionate).

For example, in the case where a silicon oxide film is formed by adeposition apparatus using ALD, hexachlorodisilane is adsorbed on asurface where a film is to be formed, and radicals of an oxidizing gas(e.g., O₂ or dinitrogen monoxide) are supplied to react with theadsorbate.

For example, in the case where a tungsten film is formed by a depositionapparatus using ALD, a WF₆ gas and a B₂H₆ gas are sequentiallyintroduced to form an initial tungsten film, and then a WF₆ gas and anH₂ gas are sequentially introduced to form a tungsten film. Note that anSiH₄ gas may be used instead of a B₂H₆ gas.

For example, in the case where an oxide semiconductor film, e.g., anIn—Ga—Zn—O layer is formed by a deposition apparatus using ALD, anIn(CH₃)₃ gas and an O₃ gas are sequentially introduced to form an In—Olayer, a Ga(CH₃)₃ gas and an O₃ gas are sequentially introduced to forma Ga—O layer, and then a Zn(CH₃)₂ gas and an O₃ gas are sequentiallyintroduced to form a Zn—O layer. Note that the order of these layers isnot limited to this example. A mixed compound layer such as an In—Ga—Olayer, an In—Zn—O layer, or a Ga—Zn—O layer may be formed by using thesegases. Although an H₂O gas that is obtained by bubbling with an inertgas such as Ar may be used instead of an O₃ gas, it is preferable to usean O₃ gas, which does not contain H.

A facing-target-type sputtering apparatus can be used for deposition ofan oxide semiconductor layer. Deposition using the facing-target-typesputtering apparatus can also be referred to as vapor deposition SP(VDSP).

When an oxide semiconductor layer is deposited using afacing-target-type sputtering apparatus, plasma damage to the oxidesemiconductor layer at the time of deposition can be reduced. Thus,oxygen vacancies in the film can be reduced. In addition, the use of thefacing-target-type sputtering apparatus enables low-pressure deposition.Accordingly, the concentration of impurities (e.g., hydrogen, a rare gas(e.g., argon), and water) in a deposited oxide semiconductor layer canbe lowered.

The structures described in this embodiment can be used in appropriatecombination with any of the structures described in the otherembodiments.

Embodiment 4

In this embodiment, the material of an oxide semiconductor that can beused for one embodiment of the present invention will be described.

An oxide semiconductor preferably contains at least indium or zinc. Inparticular, indium and zinc are preferably contained. In addition,aluminum, gallium, yttrium, tin, or the like is preferably contained asan element M. Furthermore, one or more elements selected from boron,silicon, titanium, iron, nickel, germanium, zirconium, molybdenum,lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, orthe like may be contained as an element M.

Here, the case where an oxide semiconductor contains indium, an elementM, and zinc will be considered.

First, preferred ranges of the atomic ratio of indium, the element M,and zinc contained in an oxide semiconductor according to the presentinvention will be described with reference to FIGS. 36A, 36B, and 36C.Note that the proportion of oxygen atoms is not shown. The terms of theatomic ratio of indium, the element M, and zinc contained in the oxidesemiconductor are denoted by [In], [M], and [Zn], respectively.

In FIGS. 36A to 36C, broken lines indicate a line where the atomic ratio[In]:[M]:[Zn] is (1+α): (1−α): 1, where −1≤α≤1, a line where the atomicratio [In]:[M]:[Zn] is (1+α): (1−α): 2, a line where the atomic ratio[In]:[M]:[Zn] is (1+α): (1−α): 3, a line where the atomic ratio[In]:[M]:[Zn] is (1+α): (1−α): 4, and a line where the atomic ratio[In]:[M]:[Zn] is (1+α): (1−α): 5.

Dashed-dotted lines indicate a line where the atomic ratio [In]:[M]:[Zn]is 1:1: β, where β≥0, a line where the atomic ratio [In]:[M]:[Zn] is1:2: β, a line where the atomic ratio [In]:[M]:[Zn] is 1:3: β, a linewhere the atomic ratio [In]:[M]:[Zn] is 1:4: β, a line where the atomicratio [In]:[M]:[Zn] is 2:1: β, and a line where the atomic ratio[In]:[M]:[Zn] is 5:1: β.

The oxide semiconductor illustrated in FIGS. 36A to 36C with an atomicratio of [In]:[M]:[Zn]=0:2:1 or an atomic ratio which is in theneighborhood is likely to have a spinel crystal structure.

FIGS. 36A and 36B show examples of the preferred ranges of the atomicratio of indium, the element M, and zinc contained in an oxidesemiconductor of one embodiment of the present invention.

FIG. 37 shows an example of the crystal structure of InMZnO₄ whoseatomic ratio [In]:[M]:[Zn] is 1:1:1. Note that FIG. 37 illustrates thecrystal structure of InMZnO₄ observed from a direction parallel to ab-axis. Note that a metal element in a layer that contains M, Zn, andoxygen (hereinafter, referred to as an “(M,Zn) layer”) in FIG. 37represents the element M or zinc. In that case, the proportion of theelement M is the same as the proportion of zinc. The element M and zinccan be replaced with each other, and their arrangement is random.

InMZnO₄ has a layered crystal structure (also referred to as a layeredstructure) and includes one layer that contains indium and oxygen(hereinafter, referred to as an In layer) for every two (M,Zn) layersthat contain the element M, zinc, and oxygen, as illustrated in FIG. 37.

Indium and the element M can be replaced with each other. Therefore,when the element M in the (M,Zn) layer is replaced with indium, thelayer can also be referred to as an (In,M,Zn) layer. In that case, alayered structure that contains one In layer for every two (In,M,Zn)layers is obtained.

An oxide semiconductor whose atomic ratio [In]:[M]:[Zn] is 1:1:2 has alayered structure that contains one In layer for every three (M,Zn)layers. In other words, if [Zn] is higher than [In] and [M], theproportion of the (M,Zn) layer to the In layer becomes higher when theoxide semiconductor is crystallized.

Note that in the case where the number of (M,Zn) layers with respect toone In layer is not an integer in the oxide semiconductor, the oxidesemiconductor might have plural kinds of layered structures where thenumber of (M,Zn) layers with respect to one In layer is an integer. Forexample, in the case of [In]:[M]:[Zn]=1:1:1.5, the oxide semiconductormight have the following layered structures: a layered structure of oneIn layer for every two (M,Zn) layers and a layered structure of one Inlayer for every three (M,Zn) layers.

For example, in the case where the oxide semiconductor is deposited witha sputtering apparatus, a film having an atomic ratio deviated from theatomic ratio of a target is formed. In particular, [Zn] in the filmmight be smaller than [Zn] in the target depending on the substratetemperature in deposition.

A plurality of phases (e.g., two phases or three phases) exist in theoxide semiconductor in some cases. For example, with an atomic ratio[In]:[M]:[Zn] that is close to 0:2:1, two phases of a spinel crystalstructure and a layered crystal structure are likely to exist. Inaddition, with an atomic ratio [In]:[M]:[Zn] that is close to 1:0:0, twophases of a bixbyite crystal structure and a layered crystal structureare likely to exist. In the case where a plurality of phases exist inthe oxide semiconductor, a grain boundary might be formed betweendifferent crystal structures.

In addition, the oxide semiconductor containing indium in a higherproportion can have high carrier mobility (electron mobility). This isbecause in an oxide semiconductor containing indium, the element M, andzinc, the s orbital of heavy metal mainly contributes to carriertransfer, and when the indium content in the oxide semiconductor isincreased, overlaps of the s orbitals of indium atoms are increased;therefore, an oxide semiconductor having a high content of indium hashigher carrier mobility than an oxide semiconductor having a low contentof indium.

In contrast, when the indium content and the zinc content in an oxidesemiconductor become lower, carrier mobility becomes lower. Thus, withan atomic ratio of [In]:[M]:[Zn]=0:1:0 and the vicinity thereof (e.g., aregion C in FIG. 36C), insulation performance becomes better.

Accordingly, an oxide semiconductor of one embodiment of the presentinvention preferably has an atomic ratio represented by a region A inFIG. 36A. With the atomic ratio, a layered structure with high carriermobility and a few grain boundaries is easily obtained.

A region B in FIG. 36B represents an atomic ratio of [In]:[M]:[Zn]=4:2:3to 4.1 and the vicinity thereof. The vicinity includes an atomic ratioof [In]:[M]:[Zn]=5:3:4. An oxide semiconductor with an atomic ratiorepresented by the region B is an excellent oxide semiconductor that hasparticularly high crystallinity and high carrier mobility.

Note that conditions where a layered structure of an oxide semiconductoris formed are not uniquely determined by the atomic ratio. There is adifference in the degree of difficulty in forming a layered structureamong atomic ratios. Even with the same atomic ratio, whether a layeredstructure is formed or not depends on a formation condition. Therefore,the illustrated regions each represent an atomic ratio with which anoxide semiconductor has a layered structure, and boundaries of theregions A to C are not clear.

Next, the case where the oxide semiconductor is used for a transistorwill be described.

Note that when the oxide semiconductor is used for a transistor, carrierscattering or the like at a grain boundary can be reduced; thus, thetransistor can have high field-effect mobility. In addition, thetransistor can have high reliability.

An oxide semiconductor with low carrier density is preferably used forthe transistor. For example, an oxide semiconductor whose carrierdensity is lower than 8×10¹¹/cm³, preferably lower than 1×10¹¹/cm³, morepreferably lower than 1×10¹⁰/cm³, and greater than or equal to1×10⁻⁹/cm³ is used.

A highly purified intrinsic or substantially highly purified intrinsicoxide semiconductor has few carrier generation sources and thus can havea low carrier density. A highly purified intrinsic or substantiallyhighly purified intrinsic oxide semiconductor has a low density ofdefect states and accordingly has a low density of trap states in somecases.

Charge trapped by the trap states in the oxide semiconductor takes along time to be released and may behave like fixed charge. Thus, thetransistor whose channel region is formed in the oxide semiconductorhaving a high density of trap states has unstable electricalcharacteristics in some cases.

In order to obtain stable electrical characteristics of the transistor,it is effective to reduce the concentration of impurities in the oxidesemiconductor. In order to reduce the concentration of impurities in theoxide semiconductor, the concentration of impurities in a film which isadjacent to the oxide semiconductor is preferably reduced. As examplesof the impurities, hydrogen, nitrogen, alkali metal, alkaline earthmetal, iron, nickel, silicon, and the like are given.

Here, the influence of impurities in the oxide semiconductor will bedescribed.

When silicon or carbon that is one of Group 14 elements is contained inthe oxide semiconductor, defect states are formed. Thus, the oxidesemiconductor is formed to have a region where the concentration ofsilicon or carbon (measured by secondary ion mass spectrometry (SIMS))is controlled to be lower than or equal to 2×10¹⁸ atoms/cm³, preferablylower than or equal to 2×10¹⁷ atoms/cm³ in the oxide semiconductor orthe vicinity of an interface between the oxide semiconductor and a layerin contact therewith.

When the oxide semiconductor contains alkali metal or alkaline earthmetal, defect states are formed and carriers are generated, in somecases. Thus, a transistor including an oxide semiconductor whichcontains alkali metal or alkaline earth metal is likely to be normallyon. Therefore, it is preferable to reduce the concentration of alkalimetal or alkaline earth metal of the oxide semiconductor. Specifically,the oxide semiconductor is formed to have a region where theconcentration of alkali metal or alkaline earth metal measured by SIMSis controlled to be lower than or equal to 1×10¹⁸ atoms/cm³, preferablylower than or equal to 2×10¹⁶ atoms/cm³.

When the oxide semiconductor contains nitrogen, the oxide semiconductoreasily becomes n-type by generation of electrons serving as carriers andan increase of carrier density. Thus, a transistor whose semiconductorincludes an oxide semiconductor that contains nitrogen is likely to benormally-on. For this reason, nitrogen in the oxide semiconductor ispreferably reduced as much as possible; the oxide semiconductor isformed to have a region where the concentration of nitrogen measured bySIMS is controlled to be lower than 5×10¹⁹ atoms/cm³, preferably lowerthan or equal to 5×10¹⁸ atoms/cm³, further preferably lower than orequal to 1×10¹⁸ atoms/cm³, still more preferably lower than or equal to5×10¹⁷ atoms/cm³, specifically.

Hydrogen contained in an oxide semiconductor reacts with oxygen bondedto a metal atom to be water, and thus causes an oxygen vacancy, in somecases. Entry of hydrogen into the oxygen vacancy generates an electronserving as a carrier in some cases. Furthermore, in some cases, bondingof part of hydrogen to oxygen bonded to a metal atom causes generationof an electron serving as a carrier. Thus, a transistor including anoxide semiconductor which contains hydrogen is likely to be normally on.Accordingly, it is preferable that hydrogen in the oxide semiconductorbe reduced as much as possible. Specifically, the oxide semiconductor isformed to have a region where the concentration of hydrogen measured bySIMS is controlled to be lower than 1×10²⁰ atoms/cm³, preferably lowerthan 1×10¹⁹ atoms/cm³, further preferably lower than 5×10¹⁸ atoms/cm³,still further preferably lower than 1×10¹⁸ atoms/cm³.

When an oxide semiconductor with sufficiently reduced impurityconcentration is used for a channel formation region in a transistor,the transistor can have stable electrical characteristics. A transistorin which the above highly purified oxide semiconductor is used for achannel formation region exhibits an extremely low off-state current.When voltage between a source and a drain is set at about 0.1 V, 5 V, or10 V, for example, the off-state current per channel width of thetransistor can be as low as several yoctoamperes per micrometer toseveral zeptoamperes per micrometer.

Next, the case where the oxide semiconductor has a two-layer structureor a three-layer structure will be described. A band diagram ofinsulators that are in contact with a stacked structure of an oxidesemiconductor S1, an oxide semiconductor S2, and an oxide semiconductorS3 and a band diagram of insulators that are in contact with a stackedstructure of the oxide semiconductor S2 and the oxide semiconductor S3are described with reference to FIG. 38. Note that the oxidesemiconductor S1, the oxide semiconductor S2, and the oxidesemiconductor S3 correspond to the oxide semiconductor layer 130 a, theoxide semiconductor layer 130 b, and the oxide semiconductor layer 130c, respectively.

FIG. 38A is an example of a band diagram of a stacked structure of aninsulator I1, the oxide semiconductor S1, the oxide semiconductor S2,the oxide semiconductor S3, and an insulator 12 in a film thicknessdirection. FIG. 38B is an example of a band diagram of a stackedstructure of the insulator I1, the oxide semiconductor S2, the oxidesemiconductor S3, and the insulator 12 in a film thickness direction.Note that for easy understanding, the band diagrams show the energylevel of the conduction band minimum (Ec) of each of the insulator I1,the oxide semiconductor S1, the oxide semiconductor S2, the oxidesemiconductor S3, and the insulator 12.

The energy level of the conduction band minimum of each of the oxidesemiconductors Si and S3 is closer to the vacuum level than that of theoxide semiconductor S2. Typically, a difference in energy level betweenthe conduction band minimum of the oxide semiconductor S2 and theconduction band minimum of each of the oxide semiconductors S1 and S3 ispreferably greater than or equal to 0.15 eV or greater than or equal to0.5 eV, and less than or equal to 2 eV or less than or equal to 1 eV.That is, the electron affinity of the oxide semiconductor S2 is higherthan the electron affinity of each of the oxide semiconductors Si andS3, and the difference between the electron affinity of each of theoxide semiconductors Si and S3 and the electron affinity of the oxidesemiconductor S2 is greater than or equal to 0.15 eV or greater than orequal to 0.5 eV, and less than or equal to 2 eV or less than or equal to1 eV, preferably.

As illustrated in FIGS. 38A and 38B, the conduction band minimum of eachof the oxide semiconductors Si to S3 is gradually varied. In otherwords, the energy level of the conduction band minimum is continuouslyvaried or continuously connected. In order to obtain such a banddiagram, the density of defect states in a mixed layer formed at aninterface between the oxide semiconductors Si and S2 or an interfacebetween the oxide semiconductors S2 and S3 is preferably made low.

Specifically, when the oxide semiconductors Si and S2 or the oxidesemiconductors S2 and S3 contain the same element (as a main component)in addition to oxygen, a mixed layer with a low density of defect statescan be formed. For example, in the case where the oxide semiconductor S2is an In—Ga—Zn oxide semiconductor, it is preferable to use an In—Ga—Znoxide semiconductor, a Ga—Zn oxide semiconductor, gallium oxide, or thelike as each of the oxide semiconductors Si and S3.

At this time, the oxide semiconductor S2 serves as a main carrier path.Since the density of defect states at the interface between the oxidesemiconductors Si and S2 and the interface between the oxidesemiconductors S2 and S3 can be made low, the influence of interfacescattering on carrier conduction is small, and a high on-state currentcan be obtained.

When an electron is trapped in a trap state, the trapped electronbehaves like fixed charge; thus, the threshold voltage of the transistoris shifted in a positive direction. The oxide semiconductors Si and S3can make the trap state apart from the oxide semiconductor S2. Thisstructure can prevent the positive shift of the threshold voltage of thetransistor.

A material whose conductivity is sufficiently lower than that of theoxide semiconductor S2 is used for the oxide semiconductors Si and S3.In that case, the oxide semiconductor S2, the interface between theoxide semiconductors Si and S2, and the interface between the oxidesemiconductors S2 and S3 mainly function as a channel region. Forexample, an oxide semiconductor with high insulation performance and theatomic ratio represented by the region C in FIG. 36C can be used as theoxide semiconductors Si and S3.

In the case where an oxide semiconductor with the atomic ratiorepresented by the region A is used as the oxide semiconductor S2, it isparticularly preferable to use an oxide semiconductor with an atomicratio where [M]/[In] is greater than or equal to 1, preferably greaterthan or equal to 2 as each of the oxide semiconductors S1 and S3. Inaddition, it is suitable to use an oxide semiconductor with sufficientlyhigh insulation performance and an atomic ratio where [M]/([Zn]+[In]) isgreater than or equal to 1 as the oxide semiconductor S3.

The structure described in this embodiment can be used in appropriatecombination with the structure described in any of the otherembodiments.

Embodiment 5

The structure of an oxide semiconductor that can be used for oneembodiment of the present invention will be described below.

In this specification, the term “parallel” indicates that the angleformed between two straight lines is greater than or equal to −10° andless than or equal to 10°, and accordingly also includes the case wherethe angle is greater than or equal to −5° and less than or equal to 5°.The term “perpendicular” indicates that the angle formed between twostraight lines is greater than or equal to 80□ and less than or equal to100□, and accordingly also includes the case where the angle formedbetween two straight lines is greater than or equal to 85° and less thanor equal to 95°.

In this specification, trigonal and rhombohedral crystal systems areincluded in a hexagonal crystal system.

<Structure of Oxide Semiconductor>

The structure of an oxide semiconductor will be described below.

An oxide semiconductor is classified into a single crystal oxidesemiconductor and a non-single-crystal oxide semiconductor. Examples ofa non-single-crystal oxide semiconductor include a c-axis-alignedcrystalline oxide semiconductor (CAAC-OS), a polycrystalline oxidesemiconductor, a nanocrystalline oxide semiconductor (nc-OS), anamorphous-like oxide semiconductor (a-like OS), and an amorphous oxidesemiconductor.

From another perspective, an oxide semiconductor is classified into anamorphous oxide semiconductor and a crystalline oxide semiconductor.Examples of a crystalline oxide semiconductor include a single crystaloxide semiconductor, a CAAC-OS, a polycrystalline oxide semiconductor,and an nc-OS.

An amorphous structure is generally thought to be isotropic and have nonon-uniform structure, to be metastable and not to have fixed positionsof atoms, to have a flexible bond angle, and to have a short-range orderbut have no long-range order, for example.

In other words, a stable oxide semiconductor cannot be regarded as acompletely amorphous oxide semiconductor. Moreover, an oxidesemiconductor that is not isotropic (e.g., an oxide semiconductor thathas a periodic structure in a microscopic region) cannot be regarded asa completely amorphous oxide semiconductor. In contrast, an a-like OS,which is not isotropic, has an unstable structure that contains a void.Because of its instability, an a-like OS is close to an amorphous oxidesemiconductor in terms of physical properties.

<CAAC-OS>

First, a CAAC-OS will be described.

A CAAC-OS is one of oxide semiconductors having a plurality of c-axisaligned crystal parts (also referred to as pellets).

Analysis of a CAAC-OS by X-ray diffraction (XRD) will be described. Forexample, when the structure of a CAAC-OS including an InGaZnO₄ crystalthat is classified into the space group R-3m is analyzed by anout-of-plane method, a peak appears at a diffraction angle (2θ) ofaround 31° as illustrated in FIG. 39A. This peak is derived from the(009) plane of the InGaZnO₄ crystal, which indicates that crystals inthe CAAC-OS have c-axis alignment, and that the c-axes are aligned in adirection substantially perpendicular to a surface over which theCAAC-OS film is formed (also referred to as a formation surface) or thetop surface of the CAAC-OS film. Note that a peak sometimes appears at a2θ of around 36° in addition to the peak at a 2θ of around 31°. The peakat a 2θ of around 36° is derived from a crystal structure classifiedinto the space group Fd-3m. Therefore, it is preferred that the CAAC-OSdo not show the peak at a 2θ of around 36°.

On the other hand, in structural analysis of the CAAC-OS by an in-planemethod in which an X-ray is incident on the CAAC-OS in a directionparallel to the formation surface, a peak appears at a 2θ of around 56°.This peak is attributed to the (110) plane of the InGaZnO₄ crystal. Whenanalysis (ϕ scan) is performed with 2θ fixed at around 56° and with thesample rotated using a normal vector to the sample surface as an axis (ϕaxis), as illustrated in FIG. 39B, a peak is not clearly observed. Incontrast, in the case where single crystal InGaZnO₄ is subjected to ϕscan with 2θ fixed at around 56°, as illustrated in FIG. 39C, six peakswhich are derived from crystal planes equivalent to the (110) plane areobserved. Accordingly, the structural analysis using XRD shows that thedirections of a-axes and b-axes are irregularly oriented in the CAAC-OS.

Next, a CAAC-OS analyzed by electron diffraction will be described. Forexample, when an electron beam with a probe diameter of 300 nm isincident on a CAAC-OS including an InGaZnO₄ crystal in a directionparallel to the formation surface of the CAAC-OS, a diffraction pattern(also referred to as a selected-area electron diffraction pattern)illustrated in FIG. 39D can be obtained. In this diffraction pattern,spots derived from the (009) plane of an InGaZnO₄ crystal are included.Thus, the electron diffraction also indicates that pellets included inthe CAAC-OS have c-axis alignment and that the c-axes are aligned in thedirection substantially perpendicular to the formation surface or thetop surface of the CAAC-OS. Meanwhile, FIG. 39E shows a diffractionpattern obtained in such a manner that an electron beam with a probediameter of 300 nm is incident on the same sample in a directionperpendicular to the sample surface. As illustrated in FIG. 39E, aring-like diffraction pattern is observed. Thus, the electrondiffraction using an electron beam with a probe diameter of 300 nm alsoindicates that the a-axes and b-axes of the pellets included in theCAAC-OS do not have regular orientation. The first ring in FIG. 39E isconsidered to be derived from the (010) plane, the (100) plane, and thelike of the InGaZnO₄ crystal. The second ring in FIG. 39E is consideredto be derived from the (110) plane and the like.

In a combined analysis image (also referred to as a high-resolution TEMimage) of a bright-field image and a diffraction pattern of a CAAC-OS,which is obtained using a transmission electron microscope (TEM), aplurality of pellets can be observed. However, even in thehigh-resolution TEM image, a boundary between pellets, that is, acrystal grain boundary is not clearly observed in some cases. Thus, inthe CAAC-OS, a reduction in electron mobility due to the grain boundaryis less likely to occur.

FIG. 40A shows a high-resolution TEM image of a cross section of theCAAC-OS that is observed from a direction substantially parallel to thesample surface. The high-resolution TEM image is obtained with aspherical aberration corrector function. The high-resolution TEM imageobtained with a spherical aberration corrector function is particularlyreferred to as a Cs-corrected high-resolution TEM image. TheCs-corrected high-resolution TEM image can be observed with, forexample, an atomic resolution analytical electron microscope JEM-ARM200Fmanufactured by JEOL Ltd.

FIG. 40A shows pellets in which metal atoms are arranged in a layeredmanner. FIG. 40A proves that the size of a pellet is greater than orequal to 1 nm or greater than or equal to 3 nm. Therefore, the pelletcan also be referred to as a nanocrystal (nc). Furthermore, the CAAC-OScan also be referred to as an oxide semiconductor including c-axisaligned nanocrystals (CANC). A pellet reflects unevenness of a formationsurface or a top surface of the CAAC-OS, and is parallel to theformation surface or the top surface of the CAAC-OS.

FIGS. 40B and 40C show Cs-corrected high-resolution TEM images of aplane of the CAAC-OS observed from a direction substantiallyperpendicular to the sample surface. FIGS. 40D and 40E are imagesobtained through image processing of FIGS. 40B and 40C. The method ofimage processing is as follows. The image in FIG. 40B is subjected tofast Fourier transform (FFT), so that an FFT image is obtained. Then,mask processing is performed such that a range of from 2.8 nm⁻¹ to 5.0nm⁻¹ from the origin in the obtained FFT image remains. After the maskprocessing, the FFT image is processed by inverse fast Fourier transform(IFFT) to obtain a processed image. The image obtained in this manner iscalled an FFT filtering image. The FFT filtering image is a Cs-correctedhigh-resolution TEM image from which a periodic component is extracted,and shows a lattice arrangement.

In FIG. 40D, a portion where a lattice arrangement is broken is shown bya dashed lines. A region surrounded by a dashed line is one pellet. Theportion denoted with the dashed line is a junction of pellets. Thedashed line draws a hexagon, which means that the pellet has a hexagonalshape. Note that the shape of the pellet is not always a regular hexagonbut is a non-regular hexagon in many cases.

In FIG. 40E, a dotted line denotes a boundary between a region with aregular lattice arrangement and another region with a regular latticearrangement. A clear crystal grain boundary cannot be observed even inthe vicinity of the dotted line. When a lattice point in the vicinity ofthe dotted line is regarded as a center and surrounding lattice pointsare joined, a distorted hexagon, pentagon, and/or heptagon can beformed, for example. That is, a lattice arrangement is distorted so thatformation of a crystal grain boundary is inhibited. This is probablybecause the CAAC-OS can tolerate distortion owing to a low density ofthe atomic arrangement in an a-b plane direction, an interatomic bonddistance changed by substitution of a metal element, and the like.

As described above, the CAAC-OS has c-axis alignment, its pellets(nanocrystals) are connected in an a-b plane direction, and the crystalstructure has distortion. For this reason, the CAAC-OS can also bereferred to as an oxide semiconductor including a c-axis-aligneda-b-plane-anchored (CAA) crystal.

The CAAC-OS is an oxide semiconductor with high crystallinity. Entry ofimpurities, formation of defects, or the like might decrease thecrystallinity of an oxide semiconductor. This means that the CAAC-OS hassmall amounts of impurities and defects (e.g., oxygen vacancies).

Note that the impurity means an element other than the main componentsof the oxide semiconductor, such as hydrogen, carbon, silicon, or atransition metal element. For example, an element (specifically, siliconor the like) having higher strength of bonding to oxygen than a metalelement included in an oxide semiconductor extracts oxygen from theoxide semiconductor, which results in disorder of the atomic arrangementand reduced crystallinity of the oxide semiconductor. A heavy metal suchas iron or nickel, argon, carbon dioxide, or the like has a large atomicradius (or molecular radius), and thus disturbs the atomic arrangementof the oxide semiconductor and decreases crystallinity.

<nc-OS>

Next, an nc-OS will be described.

Analysis of an nc-OS by XRD will be described. When the structure of annc-OS is analyzed by an out-of-plane method, a peak indicatingorientation does not appear. That is, a crystal of an nc-OS does nothave orientation.

For example, when an electron beam with a probe diameter of 50 nm isincident on a 34-nm-thick region of a thinned nc-OS including anInGaZnO₄ crystal in a direction parallel to the formation surface, aring-shaped diffraction pattern (nanobeam electron diffraction pattern)illustrated in FIG. 41A is observed. FIG. 41B shows a diffractionpattern obtained when an electron beam with a probe diameter of 1 nm isincident on the same sample. As illustrated in FIG. 41B, a plurality ofspots are observed in a ring-like region. In other words, ordering in annc-OS is not observed with an electron beam with a probe diameter of 50nm but is observed with an electron beam with a probe diameter of 1 nm.

Furthermore, an electron diffraction pattern in which spots are arrangedin an approximately regular hexagonal shape is observed in some cases asillustrated in FIG. 41C when an electron beam with a probe diameter of 1nm is incident on a region with a thickness of less than 10 nm. Thismeans that an nc-OS has a well-ordered region, i.e., a crystal, in therange of less than 10 nm in thickness. Note that an electron diffractionpattern having regularity is not observed in some regions becausecrystals are aligned in various directions.

FIG. 41D shows a Cs-corrected high-resolution TEM image of a crosssection of an nc-OS observed from the direction substantially parallelto the formation surface. In a high-resolution TEM image, an nc-OS has aregion in which a crystal part is observed, such as the part indicatedby additional lines in FIG. 41D, and a region in which a crystal part isnot clearly observed. In most cases, the size of a crystal part includedin the nc-OS is greater than or equal to 1 nm and less than or equal to10 nm, or specifically, greater than or equal to 1 nm and less than orequal to 3 nm. Note that an oxide semiconductor including a crystal partwhose size is greater than 10 nm and less than or equal to 100 nm issometimes referred to as a microcrystalline oxide semiconductor. In ahigh-resolution TEM image of the nc-OS, for example, a grain boundarycannot clearly observed in some cases. Note that there is a possibilitythat the origin of the nanocrystal is the same as that of a pellet in aCAAC-OS. Therefore, a crystal part of the nc-OS may be referred to as apellet in the following description.

As described above, in the nc-OS, a microscopic region (for example, aregion with a size greater than or equal to 1 nm and less than or equalto 10 nm, in particular, a region with a size greater than or equal to 1nm and less than or equal to 3 nm) has a periodic atomic arrangement.There is no regularity of crystal orientation between different pelletsin the nc-OS. Thus, the orientation of the whole film is not observed.Accordingly, the nc-OS cannot be distinguished from an a-like OS or anamorphous oxide semiconductor, depending on an analysis method.

Since there is no regularity of crystal orientation between the pellets(nanocrystals) as mentioned above, the nc-OS can also be referred to asan oxide semiconductor including random aligned nanocrystals (RANC) oran oxide semiconductor including non-aligned nanocrystals (NANC).

The nc-OS is an oxide semiconductor that has high regularity as comparedwith an amorphous oxide semiconductor. Therefore, the nc-OS is likely tohave a lower density of defect states than an a-like OS and an amorphousoxide semiconductor. Note that there is no regularity of crystalorientation between different pellets in the nc-OS. Therefore, the nc-OShas a higher density of defect states than the CAAC-OS.

<A-Like OS>

An a-like OS is an oxide semiconductor having a structure intermediatebetween those of the nc-OS and the amorphous oxide semiconductor.

FIGS. 42A and 42B are high-resolution cross-sectional TEM images of ana-like OS. FIG. 42A is the high-resolution cross-sectional TEM image ofthe a-like OS at the start of electron irradiation. FIG. 42B is thehigh-resolution cross-sectional TEM image of a-like OS after electron(e) irradiation at 4.3×10⁸ e⁻/nm². FIGS. 42A and 42B show thatstripe-like bright regions extending vertically are observed in thea-like OS from the start of electron irradiation. It can also be foundthat the shape of the bright region changes after the electronirradiation. Note that the bright region is presumably a void or alow-density region.

The a-like OS has an unstable structure because it contains a void. Toverify that an a-like OS has an unstable structure as compared with aCAAC-OS and an nc-OS, a change in structure caused by electronirradiation will be described below.

An a-like OS, an nc-OS, and a CAAC-OS are prepared as samples. Each ofthe samples is an In—Ga—Zn oxide.

First, a high-resolution cross-sectional TEM image of each sample isobtained. The high-resolution cross-sectional TEM images show that allthe samples have crystal parts.

It is known that a unit cell of an InGaZnO₄ crystal has a structure inwhich nine layers including three In—O layers and six Ga—Zn—O layers arestacked in the c-axis direction. The spacing between these adjacentlayers is equivalent to the lattice spacing on the (009) plane (alsoreferred to as d value). The value is calculated to 0.29 nm from crystalstructure analysis. Accordingly, a portion where the spacing betweenlattice fringes is greater than or equal to 0.28 nm and less than orequal to 0.30 nm is regarded as a crystal part of InGaZnO₄ in thefollowing description. Each of lattice fringes corresponds to the a-bplane of the InGaZnO₄ crystal.

FIG. 43 shows a change in the average size of crystal parts (at 22 to 30points) in each sample. Note that the crystal part size corresponds tothe length of a lattice fringe. FIG. 42 indicates that the crystal partsize in the a-like OS increases with an increase in the cumulativeelectron dose in obtaining TEM images, for example. As illustrated inFIG. 42, a crystal part of approximately 1.2 nm (also referred to as aninitial nucleus) at the start of TEM observation grows to a size ofapproximately 1.9 nm at a cumulative electron (e) dose of 4.2×10⁸e⁻/nm². In contrast, the crystal part size in the nc-OS and the CAAC-OSshows little change from the start of electron irradiation to acumulative electron dose of 4.2×10⁸ e⁻/nm². As illustrated in FIG. 42,the crystal part sizes in an nc-OS and a CAAC-OS are approximately 1.3nm and approximately 1.8 nm, respectively, regardless of the cumulativeelectron dose. For the electron beam irradiation and TEM observation, aHitachi H-9000NAR transmission electron microscope was used. Theconditions of electron beam irradiation were as follows: theaccelerating voltage was 300 kV; the current density was 6.7×10⁵e⁻/(nm²·s); and the diameter of the irradiation region was 230 nm.

In this manner, growth of the crystal part in the a-like OS is inducedby electron irradiation in some cases. In contrast, in the nc-OS and theCAAC-OS, growth of the crystal part is hardly induced by electronirradiation. Therefore, the a-like OS has an unstable structure ascompared with the nc-OS and the CAAC-OS.

The a-like OS has a lower density than the nc-OS and the CAAC-OS becauseit contains a void. Specifically, the density of the a-like OS is higherthan or equal to 78.6% and lower than 92.3% of the density of the singlecrystal oxide semiconductor having the same composition. The density ofeach of the nc-OS and the CAAC-OS is higher than or equal to 92.3% andlower than 100% of the density of the single crystal oxide semiconductorhaving the same composition. It is difficult to deposit an oxidesemiconductor whose density is lower than 78% of the density of thesingle crystal oxide semiconductor.

For example, in the case of an oxide semiconductor having an atomicratio of In:Ga:Zn=1:1:1, the density of single crystal InGaZnO₄ with arhombohedral crystal structure is 6.357 g/cm³. Accordingly, in the caseof the oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, thedensity of the a-like OS is higher than or equal to 5.0 g/cm³ and lowerthan 5.9 g/cm³. For example, in the case of the oxide semiconductorhaving an atomic ratio of In:Ga:Zn=1:1:1, the density of each of thenc-OS and the CAAC-OS is higher than or equal to 5.9 g/cm³ and lowerthan 6.3 g/cm³.

Note that in the case where an oxide semiconductor having a certaincomposition does not exist in a single crystal structure, single crystaloxide semiconductors with different compositions are combined at anadequate ratio, which makes it possible to calculate density equivalentto that of a single crystal oxide semiconductor with the desiredcomposition. The density of a single crystal oxide semiconductor havingthe desired composition can be estimated using a weighted averageaccording to the combination ratio of the single crystal oxidesemiconductors with different compositions. Note that it is preferableto use as few kinds of single crystal oxide semiconductors as possibleto estimate the density.

As described above, oxide semiconductors have various structures andvarious properties. Note that an oxide semiconductor may be a stackedlayer including two or more films of an amorphous oxide semiconductor,an a-like OS, an nc-OS, and a CAAC-OS, for example.

<Carrier Density of Oxide Semiconductor>

Next, the carrier density of an oxide semiconductor will be describedbelow.

Examples of a factor affecting the carrier density of an oxidesemiconductor include oxygen vacancy (V_(O)) and impurities in the oxidesemiconductor.

As the amount of oxygen vacancy in the oxide semiconductor increases,the density of defect states increases when hydrogen is bonded to theoxygen vacancy (this state is also referred to as V_(O)H). The densityof defect states also increases with an increase in the amount ofimpurity in the oxide semiconductor. Hence, the carrier density of anoxide semiconductor can be controlled by controlling the density ofdefect states in the oxide semiconductor.

Here, a transistor using the oxide semiconductor in a channel regionwill be considered.

The carrier density of the oxide semiconductor is preferably reduced inorder to inhibit the negative shift of the threshold voltage of thetransistor or reduce the off-state current of the transistor. In orderto reduce the carrier density of the oxide semiconductor, the impurityconcentration in the oxide semiconductor is reduced so that the densityof defect states can be reduced. In this specification and the like, astate with a low impurity concentration and a low density of defectstates is referred to as a highly purified intrinsic or substantiallyhighly purified intrinsic state. The carrier density of a highlypurified intrinsic oxide semiconductor is lower than 8×10¹⁵ cm⁻³,preferably lower than 1×10¹¹ cm⁻³, and further preferably lower than1×10¹⁰ cm⁻³ and is higher than or equal to 1×10⁻⁹ cm⁻³.

In contrast, the carrier density of the oxide semiconductor ispreferably increased in order to improve the on-state current of thetransistor or improve the field-effect mobility of the transistor. Inorder to increase the carrier density of the oxide semiconductor, theimpurity concentration or the density of defect states in the oxidesemiconductor is slightly increased. Alternatively, the bandgap of theoxide semiconductor is preferably narrowed. For example, an oxidesemiconductor that has a slightly high impurity concentration or aslightly high density of defect states in the range where a favorableon/off ratio is obtained in the I_(d)-V_(g) characteristics of thetransistor can be regarded as substantially intrinsic. Furthermore, anoxide semiconductor that has a high electron affinity and thus has anarrow bandgap so as to increase the density of thermally excitedelectrons (carriers) can be regarded as substantially intrinsic. Notethat a transistor using an oxide semiconductor with higher electronaffinity has lower threshold voltage.

The oxide semiconductor with an increased carrier density has somewhatn-type conductivity; thus, it can be referred to as a “slightly-n” oxidesemiconductor.

The carrier density of a substantially intrinsic oxide semiconductor ispreferably higher than or equal to 1×10⁵ cm⁻³ and lower than 1×10¹⁸cm⁻³, further preferably higher than or equal to 1×10⁷ cm⁻³ and lowerthan or equal to 1×10¹⁷ cm⁻³, still further preferably higher than orequal to 1×10⁹ cm⁻³ and lower than or equal to 5×10¹⁶ cm⁻³, yet furtherpreferably higher than or equal to 1×10¹⁰ cm⁻³ and lower than or equalto 1×10¹⁶ cm⁻³, and yet still preferably higher than or equal to 1×10¹¹cm⁻³ and lower than or equal to 1×10¹⁵ cm⁻³.

The structure described in this embodiment can be used in appropriatecombination with the structure described in any of the otherembodiments.

Embodiment 6

In this embodiment, examples of a package and a camera module eachincluding an image sensor chip are described. For the image sensor chip,the structure of an imaging device of one embodiment of the presentinvention can be used.

FIG. 44A is an external perspective view showing the top surface side ofa package including an image sensor chip. The package includes a packagesubstrate 810 to which an image sensor chip 850 is fixed, a cover glass820, an adhesive 830 for bonding the package substrate 810 and the coverglass 820 to each other, and the like.

FIG. 44B is an external perspective view showing the bottom surface sideof the package. On the bottom surface of the package, a ball grid array(BGA) including solder balls as bumps 840 is formed. Although the BGA isemployed here, a land grid array (LGA), a pin grid array (PGA), or thelike may be alternatively employed.

FIG. 44C is a perspective view of the package, in which the cover glass820 and the adhesive 830 are partly illustrated. FIG. 44D is across-sectional view of the package. Electrode pads 860 are formed overthe package substrate 810, and electrically connected to the bumps 840through through-holes 880 and lands 885. The electrode pads 860 areelectrically connected to electrodes of the image sensor chip 850through wires 870.

FIG. 45A is an external perspective view showing the top surface side ofa camera module in which an image sensor chip is mounted on a packagewith a built-in lens. The camera module includes a package substrate 811to which an image sensor chip 851 is fixed, a lens cover 821, a lens835, and the like. Furthermore, an IC chip 890 having functions of adriver circuit, a signal conversion circuit, and the like of an imagingdevice is provided between the package substrate 811 and the imagesensor chip 851. Thus, a system in package (SiP) is formed.

FIG. 45B is an external perspective view showing the bottom surface sideof the camera module. On the bottom surface and four side surfaces ofthe package substrate 811, mounting lands 841 are provided; thisstructure can be called a quad flat no-lead package (QFN). Although QFNis employed here, a quad flat package (QFP), the above BGA, or the likemay be alternatively employed.

FIG. 45C is a perspective view of the module, in which the lens cover821 and the lens 835 are partly illustrated. FIG. 45D is across-sectional view of the camera module. The lands 841 are partly usedas electrode pads 861. The electrode pads 861 are electrically connectedto electrodes of the image sensor chip 851 and the IC chip 890 throughwires 871.

The image sensor chip can be easily mounted on the package having theabove structure, and can be incorporated into a variety of semiconductordevices and electronic devices.

The structures described in this embodiment can be used in appropriatecombination with any of the structures described in the otherembodiments.

Embodiment 7

Examples of an electronic device that can use the imaging deviceaccording to one embodiment of the present invention, a display device,and a semiconductor device including both of them include displaydevices, personal computers, image memory devices or image reproducingdevices provided with storage media, mobile phones, game machines(including portable game machines), portable data terminals, e-bookreaders, cameras such as video cameras and digital still cameras,goggle-type displays (head mounted displays), navigation systems, audioreproducing devices (e.g., car audio players and digital audio players),copiers, facsimiles, printers, multifunction printers, automated tellermachines (ATM), and vending machines. FIGS. 46A to 46F illustratespecific examples of these electronic devices.

FIG. 46A illustrates a monitoring camera, which includes a housing 951,a lens 952, a support portion 953, and the like. The imaging device ofone embodiment of the present invention can be included as a componentfor obtaining an image in the monitoring camera. Note that a “monitoringcamera” is a common name and does not limit the uses. For example, adevice that has a function of a monitoring camera can also be called acamera or a video camera.

FIG. 46B illustrates a video camera, which includes a first housing 971,a second housing 972, a display portion 973, operation keys 974, a lens975, a joint 976, and the like. The operation keys 974 and the lens 975are provided for the first housing 971, and the display portion 973 isprovided for the second housing 972. The imaging device of oneembodiment of the present invention can be included as a component forobtaining an image in the video camera.

FIG. 46C illustrates a digital camera, which includes a housing 961, ashutter button 962, a microphone 963, a light-emitting portion 967, alens 965, and the like. The imaging device of one embodiment of thepresent invention can be included as a component for obtaining an imagein the digital camera.

FIG. 46D illustrates a wrist-watch-type information terminal, whichincludes a housing 931, a display portion 932, a wristband 933,operation buttons 935, a winder 936, a camera 939, and the like. Thedisplay portion 932 may be a touch panel. The imaging device of oneembodiment of the present invention can be included as a component forobtaining an image in the information terminal.

FIG. 46E illustrates a portable game machine, which includes housings901 and 902, display portions 903 and 904, a microphone 905, speakers906, an operation key 907, a stylus 908, a camera 909, and the like.Although the portable game machine in FIG. 46E has the two displayportions 903 and 904, the number of display portions included in aportable game machine is not limited to this. The imaging device of oneembodiment of the present invention can be included as one component forobtaining an image in the portable game machine.

FIG. 46F illustrates a portable data terminal, which includes a housing911, a display portion 912, a camera 919, and the like. A touch panelfunction of the display portion 912 enables input and output ofinformation. The imaging device of one embodiment of the presentinvention can be included as one component for obtaining an image in theportable data terminal.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

This application is based on Japanese Patent Application serial No.2015-256138 filed with Japan Patent Office on Dec. 28, 2015 and JapanesePatent Application serial No. 2016-171454 filed with Japan Patent Officeon Sep. 2, 2016, the entire contents of which are hereby incorporated byreference.

What is claimed is:
 1. An imaging device comprising: a first layercomprising a photoelectric conversion element; a second layer comprisinga first transistor comprising an oxide semiconductor in an active layer,a first insulating layer, and a first metal layer; and a third layercomprising a second transistor comprising silicon in an active layer oran active region, a second insulating layer, and a second metal layer,wherein the second layer is provided between the first layer and thethird layer, wherein the first metal layer and the second metal layerare formed using a metal element of a same main component, wherein thefirst metal layer comprises a region embedded in the first insulatinglayer and a region bonded to the second metal layer, wherein the secondmetal layer comprises a region embedded in the second insulating layer,wherein the first insulating layer comprises a region bonded to thesecond insulating layer, wherein the first transistor and the secondtransistor are arranged so that top surfaces of gate electrodes thereofface each other, wherein the photoelectric conversion element iselectrically connected to the first transistor, and wherein the firsttransistor and the second transistor are electrically connected to thefirst metal layer and the second metal layer, respectively.
 2. Theimaging device according to claim 1, wherein the second layer comprisesan n-channel third transistor comprising an oxide semiconductor in anactive layer and comprises a third metal layer, wherein the third layercomprises a p-channel fourth transistor comprising silicon in an activelayer or an active region, and comprises a fourth metal layer, whereinthe third metal layer and the fourth metal layer are formed using ametal element of a same main component, wherein the third metal layercomprises a region embedded in the first insulating layer and a regionbonded to the fourth metal layer, wherein the fourth metal layercomprises a region embedded in the second insulating layer, wherein then-channel third transistor and the p-channel fourth transistor arearranged so that top surfaces of gate electrodes thereof face eachother, and wherein the n-channel third transistor and the p-channelfourth transistor are electrically connected to the third metal layerand the fourth metal layer, respectively.
 3. The imaging deviceaccording to claim 1, wherein the metal element is Cu, Al, W, or Au. 4.The imaging device according to claim 1, wherein the oxide semiconductorcomprises In, Zn, and M (M is Al, Ga, Y, or Sn).
 5. A module comprisinga lens and the imaging device according to claim
 1. 6. An electronicdevice comprising a display device and the imaging device according toclaim
 1. 7. An imaging device comprising: a third layer comprising asecond transistor comprising silicon in an active layer or an activeregion, a second insulating layer, and a second metal layer; a secondlayer comprising a first transistor comprising an oxide semiconductor inan active layer, a first insulating layer, and a first metal layer, thesecond layer being over the third layer; and a first layer comprising aphotoelectric conversion element, the first layer being over the secondlayer, wherein the first metal layer and the second metal layer areformed using a metal element of a same main component, wherein the firstmetal layer is in contact with the second metal layer, wherein the firstinsulating layer is in contact with the second insulating layer, whereinthe first transistor and the second transistor are arranged so that topsurfaces of gate electrodes thereof face each other, and wherein thephotoelectric conversion element is electrically connected to the firsttransistor.
 8. The imaging device according to claim 7, wherein thesecond layer comprises an n-channel third transistor comprising an oxidesemiconductor in an active layer and comprises a third metal layer,wherein the third layer comprises a p-channel fourth transistorcomprising silicon in an active layer or an active region, and comprisesa fourth metal layer, wherein the third metal layer and the fourth metallayer are formed using a metal element of a same main component, whereinthe third metal layer comprises a region embedded in the firstinsulating layer and a region bonded to the fourth metal layer, whereinthe fourth metal layer comprises a region embedded in the secondinsulating layer, wherein the n-channel third transistor and thep-channel fourth transistor are arranged so that top surfaces of gateelectrodes thereof face each other, and wherein the n-channel thirdtransistor and the p-channel fourth transistor are electricallyconnected to the third metal layer and the fourth metal layer,respectively.
 9. The imaging device according to claim 7, wherein themetal element is Cu, Al, W, or Au.
 10. The imaging device according toclaim 7, wherein the oxide semiconductor comprises In, Zn, and M (M isAl, Ga, Y, or Sn).
 11. A module comprising a lens and the imaging deviceaccording to claim
 7. 12. An electronic device comprising a displaydevice and the imaging device according to claim 7.